PIC24FJ16GA002-I/SP Microchip Technology, PIC24FJ16GA002-I/SP Datasheet - Page 241

• Manufacturer Part Number: PIC24FJ16GA002-I/SP
• Description: IC PIC MCU FLASH 16K 28-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ16GA002-I/SP

• Core Size: 16-Bit
• Program Memory Size: 16KB (5.5K x 24)
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Controller Family/series: PIC24
• No. Of I/o's: 21
• Ram Memory Size: 4KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• No. Of Pwm Channels: 5
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 4 KB
• Interface Type: I2C, IrDA, SPI, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, MA240013, AC164127, DM300027, DV164033, DM240002
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC24
• Maximum Speed: 32 MHz
• Operating Supply Voltage: 2.5|3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM240011 - KIT STARTER MPLAB FOR PIC24F MCUAC162088 - HEADER MPLAB ICD2 24FJ64GA004 28AC164337 - MODULE SOCKET FOR PM3 40DIPDV164033 - KIT START EXPLORER 16 MPLAB ICD2
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

27.2
The following sections give the technical details of the packages.
© 2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
PIC24FJ64GA004 FAMILY
Preliminary
Units
A2
A1
E1
eB
b1
N
D
e
A
E
L
b
c
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
DS39881B-page 239
c