PIC16F876A-I/SP Microchip Technology, PIC16F876A-I/SP Datasheet - Page 147

IC MCU FLASH 8KX14 EE 28DIP

PIC16F876A-I/SP

Manufacturer Part Number
PIC16F876A-I/SP
Description
IC MCU FLASH 8KX14 EE 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F876A-I/SP

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
PIC16F876AI/SP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F876A-I/SP
Manufacturer:
SAMSUNG
Quantity:
2 200
Part Number:
PIC16F876A-I/SP
0
14.2
14.2.1
The PIC16F87XA can be operated in four different
oscillator modes. The user can program two configura-
tion bits (F
modes:
• LP
• XT
• HS
• RC
14.2.2
In XT, LP or HS modes, a crystal or ceramic resonator
is connected to the OSC1/CLKI and OSC2/CLKO pins
to establish oscillation (Figure 14-1). The PIC16F87XA
oscillator design requires the use of a parallel cut crys-
tal. Use of a series cut crystal may give a frequency out
of the crystal manufacturer’s specifications. When in
XT, LP or HS modes, the device can have an external
clock source to drive the OSC1/CLKI pin (Figure 14-2).
FIGURE 14-1:
 2003 Microchip Technology Inc.
Note 1: See Table 14-1 and Table 14-2 for recommended
2: A series resistor (R
3: RF varies with the crystal chosen.
C1
C2
Oscillator Configurations
(1)
(1)
values of C1 and C2.
OSC
strip cut crystals.
Low-Power Crystal
Crystal/Resonator
High-Speed Crystal/Resonator
Resistor/Capacitor
CRYSTAL OSCILLATOR/CERAMIC
RESONATORS
OSCILLATOR TYPES
1 and F
XTAL
R
s
(2)
OSC1
OSC2
OSC
CRYSTAL/CERAMIC
RESONATOR OPERATION
(HS, XT OR LP
OSC CONFIGURATION)
0) to select one of these four
s
) may be required for AT
RF
(3)
PIC16F87XA
Sleep
To
Internal
Logic
FIGURE 14-2:
TABLE 14-1:
All resonators used did not have built-in capacitors.
16.0 MHz
These values are for design guidance only.
See notes following Table 14-2.
2.0 MHz
4.0 MHz
8.0 MHz
Clock from
Ext. System
Mode
HS
XT
Murata Erie CSA16.00MX
16.0 MHz
Murata Erie CSA2.00MG
Murata Erie CSA4.00MG
Murata Erie CSA8.00MT
Open
455 kHz
2.0 MHz
4.0 MHz
8.0 MHz
Freq.
Resonators Used:
CERAMIC RESONATORS
Ranges Tested:
PIC16F87XA
EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR
LP OSC CONFIGURATION)
OSC1
OSC2
68-100 pF
15-68 pF
15-68 pF
10-68 pF
10-22 pF
OSC1
PIC16F87XA
DS39582B-page 145
68-100 pF
15-68 pF
15-68 pF
10-68 pF
10-22 pF
OSC2
0.5%
0.5%
0.5%
0.5%

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