PIC16F876A-I/SP Microchip Technology, PIC16F876A-I/SP Datasheet - Page 216

IC MCU FLASH 8KX14 EE 28DIP

PIC16F876A-I/SP

Manufacturer Part Number
PIC16F876A-I/SP
Description
IC MCU FLASH 8KX14 EE 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F876A-I/SP

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
PIC16F876AI/SP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F876A-I/SP
Manufacturer:
SAMSUNG
Quantity:
2 200
Part Number:
PIC16F876A-I/SP
0
PIC16F87XA
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
DS39582B-page 214
A1
Number of Pins
Pitch
Overall Height
Standoff
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Lead Width
Lead Length
Drawing No. C04-103
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: M0-220
*Controlling Parameter
Notes:
OPTIONAL PIN 1
TOP MARKING
INDEX ON
TOP VIEW
Dimension Limits
E
Units
A1
A3
E2
D2
D
n
p
A
E
B
L
n
MIN
2
1
EXPOSED PAD
.031
.000
.262
.262
.012
.014
A3
D
INDEX ON
A
INCHES
.026 BSC
.315 BSC
.315 BSC
.010 REF
PIN 1
NOM
D2
.035
.001
.268
.268
.013
.016
44
MAX
EXPOSED
.039
.002
.274
.274
.013
.018
METAL
BOTTOM VIEW
PAD
MIN
E2
0.80
6.65
6.65
0.30
0.35
0
MILLIMETERS*
 2003 Microchip Technology Inc.
0.65 BSC
8.00 BSC
8.00 BSC
0.25 REF
NOM
0.90
0.02
6.80
6.80
0.33
0.40
44
L
MAX
p
B
1.00
0.05
6.95
6.95
0.35
0.45

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