DSPIC33FJ64MC506-I/PT Microchip Technology, DSPIC33FJ64MC506-I/PT Datasheet - Page 22

• Manufacturer Part Number: DSPIC33FJ64MC506-I/PT
• Description: IC DSPIC MCU/DSP 64K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ64MC506-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1001 - DSPIC33 BREAKOUT BOARDDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33F
DS70165E-page 20
Table of Contents
dsPIC33F Product Families ................................................................................................................................................................... 3
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 159
11.0 Timer1 ...................................................................................................................................................................................... 161
12.0 Timer2/3, Timer4/5, Timer6/7 and Timer8/9 ............................................................................................................................ 163
13.0 Input Capture............................................................................................................................................................................ 169
14.0 Output Compare....................................................................................................................................................................... 171
15.0 Motor Control PWM Module ..................................................................................................................................................... 175
16.0 Quadrature Encoder Interface (QEI) Module ........................................................................................................................... 197
17.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 205
18.0 Inter-Integrated Circuit (I
19.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 223
20.0 Enhanced CAN Module............................................................................................................................................................ 231
21.0 Data Converter Interface (DCI) Module.................................................................................................................................... 261
22.0 10-bit/12-bit Analog-to-Digital Converter (ADC) ....................................................................................................................... 275
23.0 Special Features ...................................................................................................................................................................... 289
24.0 Instruction Set Summary .......................................................................................................................................................... 297
25.0 Development Support............................................................................................................................................................... 305
26.0 Electrical Characteristics .......................................................................................................................................................... 309
27.0 Packaging Information.............................................................................................................................................................. 351
Appendix A: Revision History............................................................................................................................................................. 357
Index ................................................................................................................................................................................................. 359
The Microchip Web Site ..................................................................................................................................................................... 365
Customer Change Notification Service .............................................................................................................................................. 365
Customer Support .............................................................................................................................................................................. 365
Reader Response .............................................................................................................................................................................. 366
Product Identification System ............................................................................................................................................................ 367
Device Overview ........................................................................................................................................................................ 23
CPU............................................................................................................................................................................................ 27
Memory Organization ................................................................................................................................................................. 39
Flash Program Memory.............................................................................................................................................................. 77
Resets ....................................................................................................................................................................................... 83
Interrupt Controller ..................................................................................................................................................................... 87
Direct Memory Access (DMA) .................................................................................................................................................. 135
Oscillator Configuration ............................................................................................................................................................ 149
Power-Saving Features............................................................................................................................................................ 157
2
C) ..................................................................................................................................................... 213
Preliminary
© 2007 Microchip Technology Inc.