DSPIC30F4011-30I/PT Microchip Technology, DSPIC30F4011-30I/PT Datasheet - Page 215

IC DSPIC MCU/DSP 48K 44TQFP

DSPIC30F4011-30I/PT

Manufacturer Part Number
DSPIC30F4011-30I/PT
Description
IC DSPIC MCU/DSP 48K 44TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F4011-30I/PT

Program Memory Type
FLASH
Program Memory Size
48KB (16K x 24)
Package / Case
44-TQFP, 44-VQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
30
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Data Rom Size
1024 B
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC30F006 - MODULE SKT FOR DSPIC30F 44TQFPAC164305 - MODULE SKT FOR PM3 44TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F401130IPT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
ATMEL
Quantity:
3 000
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
MICROCHIP
Quantity:
455
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F4011-30I/PT
0
Company:
Part Number:
DSPIC30F4011-30I/PT
Quantity:
4 800
40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)
 2005 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
n
β
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
E1
B1
eB
A1
D
p
A
E
L
B
α
A
n
c
β
A1
MIN
2.045
Preliminary
.015
.595
.160
.140
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
40
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
10
10
dsPIC30F4011/4012
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
13.46
51.94
15.75
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
NOM
40
15.24
13.84
52.26
16.51
2.54
4.45
3.30
0.29
1.27
0.46
3.81
10
10
p
α
MAX
DS70135C-page 213
A2
52.45
15.88
14.22
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15

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