PIC16F84-10I/SO Microchip Technology, PIC16F84-10I/SO Datasheet - Page 111

• Manufacturer Part Number: PIC16F84-10I/SO
• Description: IC MCU FLASH 1KX14 EE 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F84-10I/SO

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 10MHz
• Peripherals: POR, WDT
• Number Of I /o: 13
• Program Memory Type: FLASH
• Eeprom Size: 64 x 8
• Ram Size: 68 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC16F
• No. Of I/o's: 13
• Eeprom Memory Size: 64Byte
• Ram Memory Size: 68Byte
• Cpu Speed: 10MHz
• No. Of Timers: 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MIL309-1075 - ADAPTER 18-SOIC TO 18-SOIC309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

14.0
14.1
1998 Microchip Technology Inc.
PACKAGING INFORMATION
Package Marking Information
18L PDIP
18L SOIC
*
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
Legend: XX...X
Note:
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
AABBCDE
Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev# and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
AABBCDE
In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line, thus limiting the number of available
characters for customer specific information.
AA
BB
C
D
E
Microchip part number & customer specific information*
Year code (last two digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.,
S = Tempe, Arizona, U.S.A.
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Example
Example
PIC16F84-04
/SO
9648SAN
PIC16F84-04I/P
9632SAW
PIC16F8X
DS30430C-page 111