PIC18C252-I/SO Microchip Technology, PIC18C252-I/SO Datasheet - Page 149

• Manufacturer Part Number: PIC18C252-I/SO
• Description: IC MCU OTP 16KX16 A/D 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Cr

Specifications of PIC18C252-I/SO

• Core Size: 8-Bit
• Program Memory Size: 32KB (16K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 24
• Ram Memory Size: 1536Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Interface: I2C, SPI, USART
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 23
• Interface Type: I2C/SPI/USART
• On-chip Adc: 5-chx10-bit
• Number Of Timers: 4
• Embedded Interface Type: I2C, SPI, USART
• Rohs Compliant: Yes
• Processor Series: PIC18C
• Core: PIC
• Data Ram Size: 1536 B
• Maximum Clock Frequency: 40 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: ICE2000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18C452 - BOARD DAUGHTER ICEPIC3309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

14.4.16.2
During a Repeated START condition, a bus collision
occurs if:
a)
b)
When the user de-asserts SDA and the pin is allowed
to float high, the BRG is loaded with SSPADD<6:0>
and counts down to 0. The SCL pin is then de-asserted,
and when sampled high, the SDA pin is sampled.
If SDA is low, a bus collision has occurred (i.e., another
master
Figure 14-27). If SDA is sampled high, the BRG is
FIGURE 14-27:
FIGURE 14-28:
2001 Microchip Technology Inc.
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low, indi-
cating that another master is attempting to trans-
mit a data ’1’.
is
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
attempting
Bus Collision During a Repeated
START Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
to
transmit
SCL goes low before SDA,
Set BCLIF. Release SDA and SCL.
a
data
’0’,
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
reloaded and begins counting. If SDA goes from high to
low before the BRG times out, no bus collision occurs
because no two masters can assert SDA at exactly the
same time.
If SCL goes from high to low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ’1’ during the Repeated START condi-
tion, Figure 14-28.
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated START condition is
complete.
T
Cleared in software
BRG
PIC18CXX2
Interrupt cleared
in software
'0'
'0'
DS39026C-page 147
’0’