PIC18C252-I/SO Microchip Technology, PIC18C252-I/SO Datasheet - Page 218

IC MCU OTP 16KX16 A/D 28SOIC

PIC18C252-I/SO

Manufacturer Part Number
PIC18C252-I/SO
Description
IC MCU OTP 16KX16 A/D 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Cr

Specifications of PIC18C252-I/SO

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
OTP
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
24
Ram Memory Size
1536Byte
Cpu Speed
40MHz
No. Of Timers
4
Interface
I2C, SPI, USART
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
23
Interface Type
I2C/SPI/USART
On-chip Adc
5-chx10-bit
Number Of Timers
4
Embedded Interface Type
I2C, SPI, USART
Rohs Compliant
Yes
Processor Series
PIC18C
Core
PIC
Data Ram Size
1536 B
Maximum Clock Frequency
40 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
ICE2000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18C452 - BOARD DAUGHTER ICEPIC3309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18C252-I/SO
Manufacturer:
Microchip Technology
Quantity:
1 840
Part Number:
PIC18C252-I/SO
Manufacturer:
Microchip
Quantity:
400
PIC18CXX2
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS39026C-page 216
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)= 014332h
TOS
PC
Q1
operation
Pop Top of Return Stack
[ label ]
None
(TOS)
None
The TOS value is pulled off the
return stack and is discarded. The
TOS value then becomes the previ-
ous value that was pushed onto the
return stack.
This instruction is provided to
enable the user to properly manage
the return stack to incorporate a
software stack.
1
1
POP
GOTO
0000
No
Q2
bit bucket
POP
0000
NEW
POP TOS
value
= 0031A2h
= 014332h
= NEW
Q3
0000
operation
No
Q4
0110
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PUSH PC+2
onto return
Push Top of Return Stack
[ label ]
None
(PC+2)
None
The PC+2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows to implement
a software stack by modifying TOS,
and then push it onto the return
stack.
1
1
PUSH
stack
0000
Q2
2001 Microchip Technology Inc.
PUSH
TOS
0000
operation
No
Q3
=
=
=
=
=
0000
00345Ah
000124h
000126h
000126h
00345Ah
operation
Q4
No
0101

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