DSPIC30F5011-30I/PT Microchip Technology, DSPIC30F5011-30I/PT Datasheet - Page 21

IC DSPIC MCU/DSP 66K 64TQFP

DSPIC30F5011-30I/PT

Manufacturer Part Number
DSPIC30F5011-30I/PT
Description
IC DSPIC MCU/DSP 66K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F5011-30I/PT

Program Memory Type
FLASH
Program Memory Size
66KB (22K x 24)
Package / Case
64-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
52
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
52
Data Ram Size
4 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
Minimum Operating Temperature
- 40 C
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
2.5|3.3|5 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F501130IPT
DSPIC30F501130IPT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F5011-30I/PT
Manufacturer:
MICROCHIP
Quantity:
329
Part Number:
DSPIC30F5011-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F5011-30I/PT
Manufacturer:
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Quantity:
20 000
Part Number:
DSPIC30F5011-30I/PT
0
27. Module: Flash Memory
© 2010 Microchip Technology Inc.
This release of silicon draws a current (I
approximately 190 mA during any Row Erase
operation performed on program Flash memory.
Work arounds
Work around 1:
Supply the V
capable of sourcing a minimum of 190 mA of
current.
Work around 2:
When using a voltage regulator capable of driving
150 mA current, and if Brown-out Reset (BOR) is
enabled for a V
then connect a 1000 μF electrolytic capacitor
across the V
If the row erase operation is performed as part of a
RTSP operation, the user should ensure that the
device is operating at less than 10 MIPS prior to
the erase operation. To ensure the device is
operating at less than 10 MIPS, the application
may postscale the system clock or switch to the
internal FRC oscillator.
Affected Silicon Revisions
A1
X
A2
X
DD
A3
DD
pin and ground.
DD
pin using a voltage regulator
greater than or equal to 4.2V,
A4
DD
) of
28. Module: I/O
29. Module: CAN
dsPIC30F5011/5013
The port pin, RC15, is multiplexed with the primary
oscillator pin, OSC2. When pin RC15 is required
for digital input/output, specific bits in the Oscillator
Configuration register, FOSC, may be set up as
follows:
• FOS<2:0> bits (FOSC<10:8>) configured for
• FPR<4:0> bits (FOSC<4:0>) may be
For this revision of silicon, if the RC15 digital I/O
port function is desired, the FPR<4:0> bits in the
FOSC Configuration register may not be set up for
FRC w/PLL 4x/8x/16x modes.
Work around
None. In future revisions of silicon, port pin RC15
may also be configured for digital I/O when the
FPR<4:0> bits in the FOSC Configuration register
are set up for FRC w/PLL 4x/8x/16x modes.
Affected Silicon Revisions
CAN Receive filters 3, 4 and 5 may not work for a
given combination of instruction cycle speed and
CAN bit time quanta.
Work around
Do not use CAN RX filters 3, 4 and 5. Instead, use
filters 0, 1 and 2.
Affected Silicon Revisions
A1
A1
LP, LPRC, FRC, ECIO, ERCIO or ECIO
w/PLL 4x/8x/16x
configured for ECIO w/PLL 4x/8x/16x
X
X
A2
A2
X
X
A3
A3
X
A4
A4
X
DS80453E-page 21

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