DSPIC30F5011-30I/PT Microchip Technology, DSPIC30F5011-30I/PT Datasheet - Page 4

• Manufacturer Part Number: DSPIC30F5011-30I/PT
• Description: IC DSPIC MCU/DSP 66K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F5011-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 66KB (22K x 24)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 52
• Eeprom Size: 1K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 52
• Data Ram Size: 4 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 64TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F501130IPT; DSPIC30F501130IPT

dsPIC30F5011/5013
Silicon Errata Issues
1. Module: CPU
DS80453E-page 4
Note:
Sequential MAC class instructions, which prefetch
data from Y data space using ±4 address
modification, will cause an address error trap. The
trap occurs only when all of the following
conditions are true:
1. Two sequential MAC class instructions (or a
2. Both instructions prefetch data from Y data
3. Neither of the instruction uses an accumulator
Work around
The problem described above can be avoided by
using any of the following methods:
1. Inserting any other instruction between the two
2. Adding an accumulator write back (a dummy
3. Do not use the + = 4 or - = 4 address
4. Do not prefetch data from Y data space.
Affected Silicon Revisions
A1
X
MAC class instruction executed in a REPEAT or
DO loop) that prefetch from Y data space.
space using the + = 4 or - = 4 address
modification.
write back.
MAC class instructions.
write back if needed) to either of the MAC class
instructions.
modification.
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A4).
A2
X
A3
X
A4
X
2. Module: CPU
EXAMPLE 1:
L0:DAW.b
L1: ....
The Decimal Adjust instruction, DAW.b, may
improperly clear the Carry bit, C (SR<0>), when
executed.
Work around
Check the state of the Carry bit prior to executing
the DAW.b instruction. If the Carry bit is set, set the
Carry bit again after executing the DAW.b
instruction.
should process the Carry bit during a BCD addition
operation.
Affected Silicon Revisions
.include “p30f5013.inc”
.......
MOV.b
MOV.b
ADD.b
BRA
DAW.b
BSET.b
BRA
A1
X
A2
X
#0x80, w0
#0x80, w1
w0, w1, w2 ;Perform addition
NC, L0
w2
L1
w2
SR, #C
Example 1
A3
X
CHECK CARRY BIT BEFORE
DAW.b
© 2010 Microchip Technology Inc.
A4
X
shows how the application
;First BCD number
;Second BCD number
;If C set go to L0
;If not,do DAW and
;set the carry bit
;and exit