PIC18F448-I/PT Microchip Technology, PIC18F448-I/PT Datasheet - Page 384

• Manufacturer Part Number: PIC18F448-I/PT
• Description: IC PIC MCU FLASH 8KX16 44TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F448-I/PT

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Controller Family/series: PIC18
• No. Of I/o's: 33
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 768Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SPI, I2C, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 33
• Number Of Timers: 4 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164136, DM163011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
• Lead Free Status / Rohs Status: Details

44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS41159E-page 382
PIC18FXX8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
CH2 x 45
#leads=n1
Dimension Limits
n
E2
E1
§
1
E
2
CH1 x 45
Units
CH2
CH1
D2
A2
A3
E1
D1
E2
B1
n1
A1
A
E
D
B
n
p
c
D1
A2
MIN
.165
.145
.020
.024
.040
.000
.685
.685
.650
.650
.590
.590
.008
.026
.013
D
0
0
INCHES *
35
NOM
44
.050
.173
.153
.028
.029
.045
.005
.690
.690
.653
.653
.620
.620
.029
.020
.011
A
11
5
5
MAX
A3
.180
.160
.035
.034
.050
.010
.695
.695
.656
.656
.630
.630
.013
.032
.021
10
10
MIN
17.40
17.40
14.99
14.99
16.51
16.51
B1
4.19
3.68
1.02
0.00
0.20
0.66
0.33
D2
B
0.51
0.61
0
0
MILLIMETERS
p
© 2006 Microchip Technology Inc.
NOM
44
17.53
17.53
16.59
16.59
15.75
15.75
1.27
4.39
3.87
0.74
1.14
0.13
0.27
0.74
0.71
0.51
11
5
5
A1
MAX
17.65
17.65
16.66
16.66
16.00
16.00
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.53
0.81
10
10