PIC24HJ256GP610-I/PF Microchip Technology, PIC24HJ256GP610-I/PF Datasheet - Page 256

• Manufacturer Part Number: PIC24HJ256GP610-I/PF
• Description: IC PIC MCU FLASH 128KX16 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ256GP610-I/PF

• Program Memory Type: FLASH
• Program Memory Size: 256KB (85.5K x 24)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b, 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: 3-Wire/I2C/USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Number Of Timers: 13
• Operating Supply Voltage: 0 V to 2.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (32-ch x 12-bit)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24HJXXXGPX06/X08/X10
FIGURE 24-11:
TABLE 24-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
DS70175H-page 254
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
Note 1:
Param
No.
Note: Refer to Figure 24-1 for load conditions.
2:
3:
(CKP = 0)
(CKP = 1)
SCK
SDO
SS
SCK
SDI
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ
TscH2ssH
X
TscL2ssH
X
Symbol
X
X
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
Assumes 50 pF load on all SPIx pins.
X
SCKx Input Low Time
SCKx Input High Time
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SSx ↓ to SCKx ↑ or SCKx Input
SSx ↑ to SDOx Output
High-Impedance
SSx after SCKx Edge
SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SP50
Characteristic
SP35
SP71
SP40
(3)
MSb In
MSb
SP41
SP70
(3)
(3)
(1)
SP30,SP31
(3)
(3)
Bit 14 - - - -1
1.5 T
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Bit 14 - - - - - -1
Min
120
CY
30
30
20
20
10
—
—
—
—
—
+ 40
SP73
SP72
Typ
10
10
—
—
—
—
—
—
—
—
—
—
(2)
SP72
SP73
LSb
LSb In
Max
25
25
30
50
—
—
—
—
—
—
—
—
-40°C ≤ T
SP52
© 2009 Microchip Technology Inc.
Units
SP51
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
≤ +85°C for Industrial
See parameter D032
See parameter D031
Conditions
—
—
—
—
—
—
—
—
—
—