PIC24HJ256GP610-I/PF Microchip Technology, PIC24HJ256GP610-I/PF Datasheet - Page 274

• Manufacturer Part Number: PIC24HJ256GP610-I/PF
• Description: IC PIC MCU FLASH 128KX16 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ256GP610-I/PF

• Program Memory Type: FLASH
• Program Memory Size: 256KB (85.5K x 24)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b, 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: 3-Wire/I2C/USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Number Of Timers: 13
• Operating Supply Voltage: 0 V to 2.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (32-ch x 12-bit)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24HJXXXGPX06/X08/X10
DS70175H-page 272
100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
e
b
β
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 23
D
D1
Dimension Limits
E1
φ
L
NOTE 2
Units
A2
A1
E1
D1
L1
N
D
e
A
L
E
b
α
β
φ
c
E
A
A1
MIN
0.95
0.05
0.45
0.09
0.13
11°
11°
0°
–
L1
MILLIMETERS
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
0.40 BSC
1.00 REF
NOM
1.00
0.60
0.18
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-100B
© 2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.23
13°
13°
7°
A2
α