PIC18LF6520-I/PT Microchip Technology, PIC18LF6520-I/PT Datasheet - Page 360

IC MCU FLASH 16KX16 EEPROM64TQFP

PIC18LF6520-I/PT

Manufacturer Part Number
PIC18LF6520-I/PT
Description
IC MCU FLASH 16KX16 EEPROM64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18LF6520-I/PT

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC18
No. Of I/o's
52
Eeprom Memory Size
1024Byte
Ram Memory Size
2KB
Cpu Speed
40MHz
No. Of Timers
5
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
52
Number Of Timers
2 x 8 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032, DM183022
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF6520-I/PT
Manufacturer:
ST
Quantity:
856
Part Number:
PIC18LF6520-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18LF6520-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F6520/8520/6620/8620/6720/8720
28.2
The following sections give the technical details of the packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39609B-page 358
Package Details
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
(F)
CH
A2
E1
D1
n1
A1
A
L
E
D
B
n
p
c
L
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
D1
0
5
5
CH x 45
INCHES
D
NOM
A1
.020
.043
.039
.006
.024
.039
.472
.472
.394
.394
.007
.009
.035
3.5
64
16
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
0
5
5
MILLIMETERS*
 2004 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.15
0.50
1.10
1.00
0.60
1.00
0.18
0.22
0.89
3.5
64
16
10
10
MAX
12.25
12.25
10.10
10.10
A2
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7

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