PIC18F6621-I/PT Microchip Technology, PIC18F6621-I/PT Datasheet - Page 376

IC PIC MCU FLASH 32KX16 64TQFP

PIC18F6621-I/PT

Manufacturer Part Number
PIC18F6621-I/PT
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F6621-I/PT

Core Size
8-Bit
Program Memory Size
64KB (32K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC18
No. Of I/o's
53
Eeprom Memory Size
1024Byte
Ram Memory Size
3.75KB
Cpu Speed
40MHz
No. Of Timers
5
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3840 B
Interface Type
MSSP, SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F6621-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F6621-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
PIC18F6621-I/PT
Quantity:
2 850
PIC18F6525/6621/8525/8621
29.2
The following sections give the technical details of the
packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39612B-page 374
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-085
Package Details
B
c
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
β
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
(F)
n
p
E
D
B
α
A
φ
c
β
L
L
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
0
5
5
D1
φ
CH x 45°
INCHES
D
NOM
64
.020
.043
.006
.024
.472
.472
.394
.394
.007
.035
.039
.039
.009
A1
3.5
16
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.041
.011
.045
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
5
5
0
MILLIMETERS*
 2005 Microchip Technology Inc.
NOM
64
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
1.00
0.18
0.22
0.89
3.5
16
10
10
A2
MAX
α
12.25
12.25
10.10
10.10
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7

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