PIC18F8585-I/PT Microchip Technology, PIC18F8585-I/PT Datasheet - Page 469

• Manufacturer Part Number: PIC18F8585-I/PT
• Description: IC PIC MCU FLASH 24KX16 80TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F8585-I/PT

• Core Size: 8-Bit
• Program Memory Size: 48KB (24K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.25K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TFQFP
• Controller Family/series: PIC18
• No. Of I/o's: 69
• Eeprom Memory Size: 1024Byte
• Ram Memory Size: 3.25KB
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3328 B
• Interface Type: I2C, SPI, AUSART, CAN
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 69
• Number Of Timers: 8
• Operating Supply Voltage: 4.2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163015
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Package: 80TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
• Lead Free Status / Rohs Status: Details

68-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
 2004 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-049
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
CH2 x 45
#leads=n1
n
E2
Dimension Limits
E1
E
1
2
CH1 x 45
Units
CH1
CH2
A2
A1
A3
E1
D1
E2
D2
B1
n1
A
D
n
p
E
c
B
PIC18F6585/8585/6680/8680
D1
MIN
D
A2
.165
.145
.020
.024
.040
.000
.985
.985
.950
.950
.890
.890
.008
.026
.013
0
0
32
INCHES*
NOM
A
.050
.173
.153
.028
.029
.045
.005
.990
.990
.954
.954
.920
.920
.011
.029
.020
68
17
5
5
A3
MAX
.180
.160
.035
.034
.050
.010
.995
.995
.958
.958
.930
.930
.013
.032
.021
10
10
B1
B
MIN
24.13
24.13
25.02
25.02
22.61
22.61
4.19
3.68
0.51
0.61
1.02
0.00
0.20
0.66
0.33
D2
0
0
MILLIMETERS
p
NOM
25.15
25.15
24.23
24.23
23.37
23.37
1.27
4.39
3.87
0.71
0.74
1.14
0.13
0.27
0.74
0.51
68
17
5
5
DS30491C-page 467
A1
MAX
25.27
25.27
24.33
24.33
23.62
23.62
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.81
0.53
10
10