AT32UC3A3256-CTUT Atmel, AT32UC3A3256-CTUT Datasheet - Page 96
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AT32UC3A3256-CTUT
Manufacturer Part Number
AT32UC3A3256-CTUT
Description
IC MCU AVR32 256KB FLASH 144TBGA
Manufacturer
Atmel
Series
AVR®32 UC3r
Specifications of AT32UC3A3256-CTUT
Core Processor
AVR
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, WDT
Number Of I /o
110
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-TBGA
Processor Series
AT32UC3x
Core
AVR32
Data Bus Width
32 bit
Data Ram Size
96 KB
Interface Type
IrDA/SCI/SCIF/UDI
Maximum Clock Frequency
66 MHz
Number Of Timers
3
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL, KSK-EVK1100-PL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1104
Minimum Operating Temperature
- 40 C
For Use With
ATEVK1104 - KIT DEV/EVAL FOR AVR32 AT32UC3AATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT32UC3A3256-CTUT
Manufacturer:
ATMEL
Quantity:
2 757
11 Boot Sequence ....................................................................................... 39
12 Electrical Characteristics ...................................................................... 40
13 Mechanical Characteristics ................................................................... 64
14 Ordering Information ............................................................................. 69
15 Errata ....................................................................................................... 70
16 Datasheet Revision History .................................................................. 93
10.11Peripheral overview .............................................................................................35
11.1Starting of clocks ...................................................................................................39
11.2Fetching of initial instructions ................................................................................39
12.1Absolute Maximum Ratings* .................................................................................40
12.2DC Characteristics ................................................................................................41
12.3Regulator characteristics .......................................................................................42
12.4Analog characteristics ...........................................................................................42
12.5Power Consumption ..............................................................................................44
12.6Clock Characteristics .............................................................................................46
12.7Crystal Oscillator Characteristis ............................................................................47
12.8ADC Characteristics ..............................................................................................49
12.9EBI Timings ...........................................................................................................51
12.10JTAG Timings ......................................................................................................57
12.11SPI Characteristics ..............................................................................................58
12.12MACB Characteristics .........................................................................................60
12.13Flash Characteristics ...........................................................................................62
13.1Thermal Considerations ........................................................................................64
13.2Package Drawings ................................................................................................65
13.3Soldering Profile ....................................................................................................68
14.1Automotive Quality Grade .....................................................................................69
15.1Rev. K ....................................................................................................................70
15.2Rev. J ....................................................................................................................73
15.3Rev. I .....................................................................................................................76
15.4Rev. H ...................................................................................................................80
15.5Rev. E ....................................................................................................................84
16.1Rev. H – 03/09 ......................................................................................................93
16.2Rev. G – 01/09 ......................................................................................................93
16.3Rev. F – 08/08 .......................................................................................................93