LPC3250FET296/01,5 NXP Semiconductors, LPC3250FET296/01,5 Datasheet - Page 6

• Manufacturer Part Number: LPC3250FET296/01,5
• Description: IC ARM9 MCU 256K 296-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC32x0r

Specifications of LPC3250FET296/01,5

• Package / Case: 296-TFBGA
• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
• Number Of I /o: 51
• Program Memory Type: ROMless
• Ram Size: 256K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC32
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 256 KB
• Interface Type: EMC
• Maximum Clock Frequency: 266 MHz
• Number Of Timers: 6
• Operating Supply Voltage: 1.31 V to 1.39 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-57TS-LPC3250, DK-57VTS-LPC3250, SOMDIMM-LPC3250
• Development Tools By Supplier: OM11016, OM11021, OM11045
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 3 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4962; 935290766551

NXP Semiconductors
ES_LPC3250
Errata sheet
Fig 2.
Scope shot 2 - actual read timing
DMA register values used in
Results of this behavior:
1. DMA reads from an external memory will have lower performance than a software
2. Potential unintended consequence when the last DMA read accesses the address
DMACConfig = 0x01
DMACCxSrcAddr = 0xe0000000; EMC_CS0
DMACCxDestAddr = 0xe0000040; EMC_CS0
DMACCxLLI = 0x0
DMACCxControl = 0x0c480004; Dest & Src addrs increment, Dest & Src 32-bit; Dburst
& Sburst size 1; transfer size 4
DMACCxConfig = 0x01
EMCStaticConfig0 = 0x00000082; 32-bit width, Byte lane state 1
read loop. The source read burst of two, to get one transfer, will significantly increase
the time to complete all transfers in the memory-to-memory DMA, therefore
decreasing the overall throughput possible on the EMC_CSx_N static memory
interface.
beyond the DMA source buffer address in the FPGA or external peripheral chip. This
extra address is the second access during the last DMA source read.
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 1 February 2011
Figure
2:
ES_LPC3250
Errata sheet LPC3250
© NXP B.V. 2011. All rights reserved.
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