LPC2388FBD144,551 NXP Semiconductors, LPC2388FBD144,551 Datasheet - Page 41

• Manufacturer Part Number: LPC2388FBD144,551
• Description: IC ARM7 MCU FLASH 512K 144LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2388FBD144,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 144-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 104
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2388, MCB2388U, MCB2388UME
• Development Tools By Supplier: OM11012
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM11012 - BOARD EVAL FOR LPC2388568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4323; 935285417551; LPC2388FBD144-S

NXP Semiconductors
Table 5.
T
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] To V
[11] Includes external resistors of 18 Ω ± 1 % on D+ and D−.
Table 6.
V
LPC2388_0
Preliminary data sheet
Symbol
V
V
V
V
V
C
Z
R
Symbol
V
C
E
E
E
E
E
R
amb
DDA
DRV
DI
CM
th(rs)se
OL
OH
IA
D
L(adj)
O
G
T
trans
pu
ia
vsi
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages
The RTC typically fails when V
Including voltage on outputs in 3-state mode.
V
3-state outputs go into 3-state mode when V
Accounts for 100 mV voltage drop in all supply lines.
Only allowed for a short time period.
Minimum condition for V
On pin VBAT.
=
= 2.5 V to 3.6 V; T
DD(3V3)
−
40
SS
.
°
Static characteristics
ADC static characteristics
supply voltages must be present.
C to +85
Parameter
analog input voltage
analog input capacitance
differential linearity error
integral non-linearity
offset error
gain error
absolute error
voltage source interface
resistance
Parameter
differential input
sensitivity
differential common
mode voltage range
single-ended receiver
switching threshold
voltage
LOW-level output
voltage for
low-/full-speed
HIGH-level output
voltage (driven) for
low-/full-speed
transceiver
capacitance
driver output
impedance for driver
which is not
high-speed capable
pull-up resistance
°
C for commercial applications, unless otherwise specified.
amb
I
= 4.5 V, maximum condition for V
=
−
40
i(VBAT)
°
C to +85
…continued
drops below 1.6 V.
Conditions
|(D+) − (D−)|
includes V
R
R
pin to GND
with 33 Ω series resistor;
steady state drive
SoftConnect = ON
Conditions
DD(3V3)
L
L
°
C unless otherwise specified; ADC frequency 4.5 MHz.
of 1.5 kΩ to 3.6 V
of 15 kΩ to GND
Rev. 00.01 — 23 October 2007
is grounded.
DI
range
I
= 5.5 V.
[1][2][3]
[1][4]
[1][5]
[1][6]
[1][7]
[8]
[11]
Min
0
-
-
-
-
-
-
-
Min
0.2
0.8
0.8
-
2.8
-
36
1.1
Typ
-
-
-
-
-
-
-
-
Typ
-
-
-
-
-
-
-
-
Fast communication chip
[1]
Max
V
1
±1
±2
±3
±0.5
±4
40
LPC2388
© NXP B.V. 2007. All rights reserved.
DDA
Max
-
2.5
2.0
0.18
3.5
20
44.1
1.9
Unit
V
pF
LSB
LSB
LSB
%
LSB
kΩ
41 of 57
Unit
V
V
V
V
V
pF
Ω
kΩ