LPC2468FBD208,551 NXP Semiconductors, LPC2468FBD208,551 Datasheet - Page 23

IC ARM7 MCU FLASH 512K 208-LQFP

LPC2468FBD208,551

Manufacturer Part Number
LPC2468FBD208,551
Description
IC ARM7 MCU FLASH 512K 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets

Specifications of LPC2468FBD208,551

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
160
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2S/ISP/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
6
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, IRD-LPC2468-DEV, SAB-TFBGA208, KSK-LPC2468-PL
Development Tools By Supplier
OM10100
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1025 - KIT DEV IND REF DESIGN LPC2468622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4358 - DISPLAY QVGA TFT FOR OM10100568-4309 - BOARD EXTENSION LPCSTICK568-4308 - EVAL LPC-STICK WITH LPC2468MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4261
935282457551
LPC2468FBD208-S

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LPC2468FBD208,551
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NXP Semiconductors
Table 4.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[11] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
[12] If the RTC is not used, these pins can be left floating.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
[15] Pad provides special analog functionality.
[16] Pad provides special analog functionality.
[17] Pad provides special analog functionality.
[18] Pad provides special analog functionality.
LPC2468
Product data sheet
Symbol
V
n.c.
V
V
VREF
VBAT
DD(3V3)
DD(DCDC)(3V3)
DDA
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled.
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
Open-drain 5 V tolerant digital I/O pad, compatible with I
functionality. When power is switched off, this pin connected to the I
configuration applies to all functions on this pin.
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
Pad provides special analog functionality.
This pin has a built-in pull-up resistor.
This pin has no built-in pull-up and no built-in pull-down resistor.
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
Pin description
Pin
15, 60,
71, 89,
112,
125,
146,
165,
181,
198
30, 117,
141
26, 86,
174
20
24
38
[18]
[18]
[18]
[15]
[16]
[17]
…continued
Ball
G3, P6,
P8, U13,
P17,
K16,
C17,
B13, C9,
D7
J4, L14,
G14
H4, P11,
D11
G4
K1
M3
[18]
[15]
[18]
[18]
[17]
[16]
All information provided in this document is subject to legal disclaimers.
Type
I
I
I
I
I
I
Rev. 5 — 15 October 2010
Description
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
not connected pins: These pins must be left unconnected (floating).
3.3 V DC-to-DC converter supply voltage: This is the power supply for
the on-chip DC-to-DC converter.
analog 3.3 V pad supply voltage: This should be nominally the same
voltage as V
This voltage is used to power the ADC and DAC.
ADC reference: This should be nominally the same voltage as V
but should be isolated to minimize noise and error. The level on this pin is
used as a reference for ADC and DAC.
RTC power supply: 3.3 V on this pin supplies the power to the RTC.
2
C-bus 400 kHz specification. It requires an external pull-up to provide output
DD(3V3)
2
C-bus is floating and does not disturb the I
but should be isolated to minimize noise and error.
Single-chip 16-bit/32-bit micro
2
LPC2468
© NXP B.V. 2010. All rights reserved.
C lines. Open-drain
DD(3V3)
23 of 85

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