MC9S08QG8CPBE Freescale Semiconductor, MC9S08QG8CPBE Datasheet - Page 65
![IC MCU 8K FLASH 10MHZ 16-DIP](/photos/12/15/121575/mc9s08qg8cpbe_sml.jpg)
MC9S08QG8CPBE
Manufacturer Part Number
MC9S08QG8CPBE
Description
IC MCU 8K FLASH 10MHZ 16-DIP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08QG8CDTER.pdf
(314 pages)
Specifications of MC9S08QG8CPBE
Core Processor
HCS08
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
16-DIP (0.300", 7.62mm)
Processor Series
S08QG
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08QG8E
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
For Use With
DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08QG8CPBE
Manufacturer:
CYPRESS
Quantity:
310
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The IRQ pin, when enabled, defaults to use an internal pullup device (IRQPDD = 0). If the user desires to
use an external pullup, the IRQPDD can be written to a 1 to turn off the internal device.
BIH and BIL instructions may be used to detect the level on the IRQ pin when the pin is configured to act
as the IRQ input.
5.5.2.2
The IRQMOD control bit reconfigures the detection logic so it detects edge events and pin levels. In this
edge detection mode, the IRQF status flag becomes set when an edge is detected (when the IRQ pin
changes from the deasserted to the asserted level), but the flag is continuously set (and cannot be cleared)
as long as the IRQ pin remains at the asserted level.
5.5.3
Table 5-2
bottom of the table. The high-order byte of the address for the interrupt service routine is located at the
first address in the vector address column, and the low-order byte of the address for the interrupt service
routine is located at the next higher address.
When an interrupt condition occurs, an associated flag bit becomes set. If the associated local interrupt
enable is 1, an interrupt request is sent to the CPU. Within the CPU, if the global interrupt mask (I bit in
the CCR) is 0, the CPU will finish the current instruction; stack the PCL, PCH, X, A, and CCR CPU
registers; set the I bit; and then fetch the interrupt vector for the highest priority pending interrupt.
Processing then continues in the interrupt service routine.
Freescale Semiconductor
provides a summary of all interrupt sources. Higher-priority sources are located toward the
Interrupt Vectors, Sources, and Local Masks
Edge and Level Sensitivity
This pin does not contain a clamp diode to V
above V
The voltage measured on the internally pulled-up IRQ pin will not be pulled
to V
pullup should not be used to pull up components external to the MCU. The
internal gates connected to this pin are pulled all the way to V
DD
. The internal gates connected to this pin are pulled to V
DD
.
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
NOTE
Chapter 5 Resets, Interrupts, and General System Control
DD
and should not be driven
DD
DD
. The IRQ
.
63
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