C8051F333-GM Silicon Laboratories Inc, C8051F333-GM Datasheet - Page 114
![IC 8051 MCU 4KB FLASH 20QFN](/photos/12/15/121597/c8051f333-gm_sml.jpg)
C8051F333-GM
Manufacturer Part Number
C8051F333-GM
Description
IC 8051 MCU 4KB FLASH 20QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F33xr
Specifications of C8051F333-GM
Program Memory Type
FLASH
Program Memory Size
4KB (4K x 8)
Package / Case
20-QFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
17
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F330DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1451 - ADAPTER PROGRAM TOOLSTICK F330
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1267
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F333-GMR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
- Current page: 114 of 210
- Download datasheet (2Mb)
C8051F330/1/2/3/4/5
13.3.1. External Crystal Example
If a crystal or ceramic resonator is used as an external oscillator source for the MCU, the circuit should be
configured as shown in Figure 13.1, Option 1. The External Oscillator Frequency Control value (XFCN)
should be chosen from the Crystal column of the table in SFR Definition 13.4 (OSCXCN register). For
example, an 11.0592 MHz crystal requires an XFCN setting of 111b and a 32.768 kHz Watch Crystal
requires an XFCN setting of 001b. After an external 32.768 kHz oscillator is stabilized, the XFCN setting
can be switched to 000 to save power. It is recommended to enable the missing clock detector before
switching the system clock to any external oscillator source.
When the crystal oscillator is first enabled, the oscillator amplitude detection circuit requires a settling time
to achieve proper bias. Introducing a delay of 1 ms between enabling the oscillator and checking the
XTLVLD bit will prevent a premature switch to the external oscillator as the system clock. Switching to the
external oscillator before the crystal oscillator has stabilized can result in unpredictable behavior. The rec-
ommended procedure is:
Important Note on External Crystals: Crystal oscillator circuits are quite sensitive to PCB layout. The
crystal should be placed as close as possible to the XTAL pins on the device. The traces should be as
short as possible and shielded with ground plane from any other traces which could introduce noise or
interference.
118
Step 1. Force XTAL1 and XTAL2 to a low state. This involves enabling the Crossbar and writing ‘0’
Step 2. Configure XTAL1 and XTAL2 as analog inputs using register P0MDIN.
Step 3. Enable the external oscillator.
Step 4. Wait at least 1 ms.
Step 5. Poll for XTLVLD => ‘1’.
Step 6. Enable the Missing Clock Detector.
Step 7. Switch the system clock to the external oscillator.
to port latches P0.2 and P0.3.
Rev. 1.7
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