MC9S08LL8CGT Freescale Semiconductor, MC9S08LL8CGT Datasheet - Page 14

IC MCU 8BIT 8K FLASH 48-QFN

MC9S08LL8CGT

Manufacturer Part Number
MC9S08LL8CGT
Description
IC MCU 8BIT 8K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08LL8CGT

Core Processor
HCS08
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SCI, SPI
Peripherals
LCD, LVD, POR, PWM, WDT
Number Of I /o
31
Program Memory Size
10KB (10K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN
Processor Series
S08LL
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2080 B
Interface Type
I2C/SCI/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
31
Number Of Timers
2
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
TWR-SER, TWR-ELEV, TWR-S08LL64, TWR-SENSOR-PAK, TWR-S08LL64-KIT, TWR-LCD
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
1
2
3
4
5
6
7
8
Num C
Electrical Characteristics
12
13
14
15
16
17
18
19
20
21
22
23
14
Typical values are measured at 25 C. Characterized, not tested
All I/O pins except for LCD pins in open drain mode.
Total leakage current is the sum value for all GPIO pins. This leakage current is not distributed evenly across all pins but
characterization data shows that individual pin leakage current maximums are less than 250 nA.
All functional non-supply pins, except for PTB2 are internally clamped to V
Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate
resistance values for positive and negative clamp voltages, then use the larger of the two values.
Power supply must maintain regulation within operating V
conditions. If the positive injection current (V
result in external power supply going out of regulation. Ensure that external V
injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is
present, or if clock rate is very low (which would reduce overall power consumption).
POR will occur below the minimum voltage.
Factory trimmed at V
P
P
P Pullup,
P
D
C Input capacitance, all pins
C RAM retention voltage
C POR re-arm voltage
D POR re-arm time
P Low-voltage detection threshold
P Low-voltage warning threshold
P Low-voltage inhibit reset/recover hysteresis
P Bandgap voltage reference
Hi-Z (off-state)
leakage
current
Total leakage
current
pulldown
resistors when
enabled
DC injection
current
3
4, 5, 6
DD
Characteristic
= 3.0 V, Temp = 25 C.
Total leakage current for all
Single pin limit
Total MCU limit, includes
sum of all stressed pins
7
PTA[4:5], PTD[0:7],
PTB[0:7], PTC[0:7]
PTA[0:3], PTA[6:7],
8
all input/output
Table 8. DC Characteristics (continued)
MC9S08LL16 Series MCU Data Sheet, Rev. 6
PTE[0:7]
(per pin)
In
> V
pins
DD
) is greater than I
Symbol
V
V
V
V
R
t
|I
|I
V
R
V
POR
C
I
RAM
POR
LVW
OZ
InT
LVD
PU,
IC
hys
PD
BG
In
DD
|
|
range during instantaneous and operating maximum current
V
IN
V
V
In
In
< V
Condition
= V
= V
DD
SS
DD
DD
, the injection current may flow out of V
, V
V
V
V
V
SS
DD
DD
or V
or V
IN
DD
DD
and V
DD
> V
falling
falling
rising
rising
SS
SS
load will shunt current greater than maximum
DD
DD
.
17.5
–0.2
1.80
1.88
2.08
1.15
Min
0.9
–5
10
0.025
Typ
1.84
1.92
2.14
1.17
0.6
1.4
80
Freescale Semiconductor
1
Max
52.5
69.5
1.88
1.96
1.18
DD
0.2
1.0
2.0
2.2
1
2
5
8
and could
Unit
mA
mA
mV
A
A
k
pF
s
V
V
V
V
V

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