MC9S08QE32CFT Freescale Semiconductor, MC9S08QE32CFT Datasheet - Page 11

MCU 8BIT 32K FLASH 48-QFN

MC9S08QE32CFT

Manufacturer Part Number
MC9S08QE32CFT
Description
MCU 8BIT 32K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08QE32CFT

Core Processor
HCS08
Core Size
8-Bit
Speed
50MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, PWM, WDT
Number Of I /o
38
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN
Cpu Family
HCS08
Device Core Size
8b
Interface Type
SCI/SPI
# I/os (max)
40
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
On-chip Adc
10-chx12-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
QFN EP
Processor Series
S08QE
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Number Of Programmable I/os
40
Operating Supply Voltage
- 0.3 V to + 3.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMOQE128, EVBQE128
Minimum Operating Temperature
- 40 C
For Use With
DEMO9S08QE32 - DEMO FOR S08 AND QE32/16DC9S08QE32 - DAUGHTER CARD FOR DEMO9S
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
The average chip-junction temperature (T
where:
T
θ
P
P
P
For most applications, P
(if P
Solving
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P
solving
Freescale Semiconductor
JA
A
D
int
I/O
D
= Ambient temperature, °C
= P
(at equilibrium) for a known T
= Package thermal resistance, junction-to-ambient, °C/W
= I
I/O
= Power dissipation on input and output pins — user determined
int
DD
is neglected) is:
Equation 1
Equation 1
+ P
× V
I/O
DD
, Watts — chip internal power
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
and
and
Single-layer board
Four-layer board
Equation 2
I/O
Equation 2
48-pin QFN
44-pin LQFP
32-pin LQFP
28-pin SOIC
48-pin QFN
44-pin LQFP
32-pin LQFP
28-pin SOIC
<< P
Rating
int
K = P
MC9S08QE32 Series MCU Data Sheet, Rev. 6
A
and can be neglected. An approximate relationship between P
iteratively for any value of T
. Using this value of K, the values of P
for K gives:
Table 4. Thermal Characteristics
D
P
T
× (T
D
J
J
= K ÷ (T
) in °C can be obtained from:
= T
A
+ 273°C) + θ
A
+ (P
J
+ 273°C)
D
Symbol
× θ
T
θ
θ
T
JM
JA
JA
JA
A
JA
)
× (P
D
A
)
.
2
–40 to 85
T
Value
L
95
81
68
66
57
26
46
54
42
to T
H
D
and T
J
°C/W
°C/W
Electrical Characteristics
Unit
can be obtained by
°C
°C
D
and T
Eqn. 1
Eqn. 2
Eqn. 3
11
J

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