MC9S08QE32CFT Freescale Semiconductor, MC9S08QE32CFT Datasheet - Page 11

• Manufacturer Part Number: MC9S08QE32CFT
• Description: MCU 8BIT 32K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QE32CFT

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN
• Cpu Family: HCS08
• Device Core Size: 8b
• Interface Type: SCI/SPI
• # I/os (max): 40
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• On-chip Adc: 10-chx12-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: QFN EP
• Processor Series: S08QE
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Number Of Programmable I/os: 40
• Operating Supply Voltage: - 0.3 V to + 3.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOQE128, EVBQE128
• Minimum Operating Temperature: - 40 C
• For Use With: DEMO9S08QE32 - DEMO FOR S08 AND QE32/16DC9S08QE32 - DAUGHTER CARD FOR DEMO9S
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

The average chip-junction temperature (T
where:
T
θ
P
P
P
For most applications, P
(if P
Solving
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P
solving
Freescale Semiconductor
JA
A
D
int
I/O
D
= Ambient temperature, °C
= P
(at equilibrium) for a known T
= Package thermal resistance, junction-to-ambient, °C/W
= I
I/O
= Power dissipation on input and output pins — user determined
int
DD
is neglected) is:
Equation 1
Equation 1
+ P
× V
I/O
DD
, Watts — chip internal power
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
and
and
Single-layer board
Four-layer board
Equation 2
I/O
Equation 2
48-pin QFN
44-pin LQFP
32-pin LQFP
28-pin SOIC
48-pin QFN
44-pin LQFP
32-pin LQFP
28-pin SOIC
<< P
Rating
int
K = P
MC9S08QE32 Series MCU Data Sheet, Rev. 6
A
and can be neglected. An approximate relationship between P
iteratively for any value of T
. Using this value of K, the values of P
for K gives:
Table 4. Thermal Characteristics
D
P
T
× (T
D
J
J
= K ÷ (T
) in °C can be obtained from:
= T
A
+ 273°C) + θ
A
+ (P
J
+ 273°C)
D
Symbol
× θ
T
θ
θ
T
JM
JA
JA
JA
A
JA
)
× (P
D
A
)
.
2
–40 to 85
T
Value
L
95
81
68
66
57
26
46
54
42
to T
H
D
and T
J
°C/W
°C/W
Electrical Characteristics
Unit
can be obtained by
°C
°C
D
and T
Eqn. 1
Eqn. 2
Eqn. 3
11
J