C8051F321-GM Silicon Laboratories Inc, C8051F321-GM Datasheet - Page 114

IC 8051 MCU 16K FLASH 28MLP

C8051F321-GM

Manufacturer Part Number
C8051F321-GM
Description
IC 8051 MCU 16K FLASH 28MLP
Manufacturer
Silicon Laboratories Inc
Series
C8051F32xr
Datasheets

Specifications of C8051F321-GM

Program Memory Type
FLASH
Program Memory Size
16KB (16K x 8)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
21
Ram Size
2.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
2.25 KB
Interface Type
I2C/SMBus/SPI/UART/USB
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
21
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F320DK
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit or 17-ch x 10-bit
No. Of I/o's
21
Ram Memory Size
1280Byte
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1480 - DAUGHTER CARD TOOLSTCK C8051F321770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1449 - ADAPTER PROGRAM TOOLSTICK F321336-1260 - DEV KIT FOR C8051F320/F321
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1261

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C8051F320/1
12. External RAM
The C8051F320/1 devices include 2048 bytes of on-chip XRAM. This XRAM space is split into user RAM
(addresses 0x0000 - 0x03FF) and USB0 FIFO space (addresses 0x0400 - 0x07FF).
12.1. Accessing User XRAM
XRAM can be accessed using the external move instruction (MOVX) and the data pointer (DPTR), or using
MOVX indirect addressing mode. If the MOVX instruction is used with an 8-bit address operand (such as
@R1), then the high byte of the 16-bit address is provided by the External Memory Interface Control Reg-
ister (EMI0CN as shown in Figure 12.1). Note: the MOVX instruction is also used for writes to the Flash
memory. See Section “11. Flash Memory” on page 106 for details. The MOVX instruction accesses XRAM
by default.
For any of the addressing modes the upper 5 bits of the 16-bit external data memory address word are
"don't cares". As a result, the 2048-byte RAM is mapped modulo style over the entire 64k external data
memory address range. For example, the XRAM byte at address 0x0000 is also at address 0x0800,
0x1000, 0x1800, 0x2000, etc.
Important Note: The upper 1k of the 2k XRAM functions as USB FIFO space. See Section 12.2 for
details on accessing this memory space.
12.2. Accessing USB FIFO Space
The upper 1k of XRAM functions as USB FIFO space. Figure 12.2 shows an expanded view of the FIFO
space and user XRAM. FIFO space is accessed via USB FIFO registers; see Section “15.5. FIFO Manage-
ment” on page 147 for more information on accessing these FIFOs. The MOVX instruction should not be
used to load or modify USB data in the FIFO space.
Unused areas of the FIFO space may be used as general purpose XRAM, accessible as described in Sec-
tion 12.1. The FIFO block operates on the USB clock domain; thus the USB clock must be active when
accessing FIFO space. Note that the number of SYSCLK cycles required by the MOVX instruction is
increased when accessing USB FIFO space.
Important Note: The USB clock must be active when accessing FIFO space.
114
0xFFFF
0x07FF
0x03FF
0x0800
0x0400
0x0000
Figure 12.1. External Ram Memory Map
0x0000 to 0x07FF, wrapped
Same 2048 bytes as from
on 2 kB boundaries
USB FIFOs
1024 Bytes
1024 Bytes
XRAM
Rev. 1.4
Accessed through USB FIFO
registers
Accessed with the MOVX
instruction

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