MCF52213CAE50 Freescale Semiconductor, MCF52213CAE50 Datasheet - Page 29

• Manufacturer Part Number: MCF52213CAE50
• Description: IC MCU 32BIT 128K FLASH 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF5221xr

Specifications of MCF52213CAE50

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: MCF522x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, QSPI, UART
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 43
• Number Of Timers: 18
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M52210DEMO, M52211EVB
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• A/d Bit Size: 12 bit
• A/d Channels Available: 8
• Height: 1.4 mm
• Length: 10 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Width: 10 mm
• For Use With: M52210DEMO - BOARD DEV MCF5221X LOW COST
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Electrical Characteristics
2.3
Table 22
29
81 MAPBGA Junction to ambient, natural convection
100 LQFP
64 LQFP
64 QFN
lists thermal resistance values.
Thermal Characteristics
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case (bottom)
Junction to top of package
Maximum operating junction temperature
MCF52211 ColdFire Microcontroller, Rev. 2
Table 22. Thermal Characteristics
Characteristic
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
—
—
—
—
—
—
—
—
—
—
—
—
Symbol




























JMA
JMA
JMA
JMA
JMA
JMA
JMA
JMA
T
T
T
T
JA
JA
JB
JC
JA
JA
JB
JC
JA
JA
JB
JC
JA
JA
JB
JC
jt
j
jt
j
jt
j
jt
j
Freescale Semiconductor
Value
53
39
42
33
61
35
50
31
62
43
50
36
68
24
55
19
0.6
105
105
105
105
25
20
12
26
9
2
2
9
2
8
3
1,2
1,3
1,3
1,3
5
6
1,2
2,3
2,3
2,3
6
1,2
1,3
1,3
1,3
5
6
1,2
1,3
1,3
1,3
4
6
4
4
5
4
5
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
Unit
o
o
o
o
C
C
C
C