SAK-XC2786X-96F66L AC Infineon Technologies, SAK-XC2786X-96F66L AC Datasheet - Page 119
![IC MCU 16BIT FLASH PG-LQFP-144](/photos/12/23/122314/sak-xc2786x-96f66l_ac_sml.jpg)
SAK-XC2786X-96F66L AC
Manufacturer Part Number
SAK-XC2786X-96F66L AC
Description
IC MCU 16BIT FLASH PG-LQFP-144
Manufacturer
Infineon Technologies
Series
XC27x6Xr
Datasheet
1.SAK-XC2786X-96F66L_AC.pdf
(120 pages)
Specifications of SAK-XC2786X-96F66L AC
Core Processor
C166SV2
Core Size
16/32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
116
Program Memory Size
768KB (768K x 8)
Program Memory Type
FLASH
Ram Size
51K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-LFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
KX2786X96F66LACXT
SAK-XC2786X-96F66LACINTR
SP000369364
SAK-XC2786X-96F66LACINTR
SP000369364
- Current page: 119 of 120
- Download datasheet (2Mb)
5.2
When operating the XC2786X in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
∆T = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(see
OH
+
) ×
P
Section
IODYN
I
OH
) + Σ(
) ×
R
4.2.3).
ΘJA
V
OL
×
I
OL
117
)
R
ΘJA
” quantifies these parameters. The
XC2000 Family Derivatives
Package and Reliability
P
IODYN
V2.1, 2008-08
XC2786X
) depends
Related parts for SAK-XC2786X-96F66L AC
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![sak-xc2786x-96f66l-ac](/images/no-image3.png)
Part Number:
Description:
16/32-bit Single-chip Microcontroller With 32-bit Performance
Manufacturer:
Infineon Technologies Corporation
Datasheet:
![BFP620](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
Manufacturer:
Infineon Technologies AG
Datasheet:
![BG3123R](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
Manufacturer:
Infineon Technologies AG
Datasheet:
![BG3130](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
Manufacturer:
Infineon Technologies AG
Datasheet:
![BG3130R](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
Manufacturer:
Infineon Technologies AG
Datasheet:
![BG3230](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
Manufacturer:
Infineon Technologies AG
Datasheet:
![BGA428](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
Manufacturer:
Infineon Technologies AG
Datasheet:
![BGA616](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
Manufacturer:
Infineon Technologies AG
Datasheet:
![SAB-C167CR-LM](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
16-bit microcontroller with 2x2 KByte RAM
Manufacturer:
Infineon Technologies AG
Datasheet:
![BFP182W](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
NPN silicon RF transistor
Manufacturer:
Infineon Technologies AG
Datasheet:
![BFP193W](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
NPN silicon RF transistor
Manufacturer:
Infineon Technologies AG
Datasheet:
![BFP450](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
NPN silicon RF transistor
Manufacturer:
Infineon Technologies AG
Datasheet:
![BFP520](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
NPN silicon RF transistor
Manufacturer:
Infineon Technologies AG
Datasheet:
![BGA420](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
Si-MMIC-amplifier in SIEGET 25-technologie
Manufacturer:
Infineon Technologies AG
Datasheet:
![BSM20GD60DN2](/images/manufacturer_photos/0/3/328/infineon_technologies_ag_tmb.jpg)
Part Number:
Description:
IGBT Power Module
Manufacturer:
Infineon Technologies AG
Datasheet: