PIC16F526-I/P Microchip Technology, PIC16F526-I/P Datasheet - Page 80

IC PIC MCU FLASH 1KX12 14DIP

PIC16F526-I/P

Manufacturer Part Number
PIC16F526-I/P
Description
IC PIC MCU FLASH 1KX12 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets

Specifications of PIC16F526-I/P

Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
11
Ram Size
67 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 3x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
67 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162096 - HEADER MPLAB ICD2 PIC16F526 8/14
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC16F526
14.2
DS41326A-page 78
DC Characteristics
D001
D002
D003
D004
D010
D020
D022
D023
D022
D023
D024
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
Param
No.
*
2: This is the limit to which V
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
4: The test conditions for all I
5: For standby current measurements, the conditions are the same as I
6: Does not include current through R
DC Characteristics: PIC16F526 (Extended)
V
V
V
S
I
I
I
ICMP
I
I
ΔI
These parameters are characterized but not tested.
guidance only and is not tested.
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
V
mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep.
I = V
DD
PD
WDT
VREF
FVR
Sym
DD
DR
POR
VDD
DD
AD
; WDT enabled/disabled as specified.
DD
/2R
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
Power-on Reset
Supply Current
Power-down Current
WDT Current
Comparator Current
V
Internal 0.6V Fixed Voltage
Reference Current
A/D Conversion Current
REF
DD
DD
EXT
Start Voltage to ensure
Rise Rate to ensure
Current
(mA) with R
Characteristic
(5)
(5)
(3,4)
DD
DD
EXT
(5)
can be lowered in Sleep mode without losing RAM data.
measurements in Active Operation mode are:
(5)
(5)
in kΩ.
EXT
(2)
. The current through the resistor can be estimated by the formula:
Preliminary
Standard Operating Conditions (unless otherwise specified)
Operating Temperature 40°C ≤ T
0.05*
Min
2.0
Typ
0.625
0.35
1.5*
Vss
175
250
175
120
200
1.0
1.8
0.1
1.0
7.0
11
38
15
55
30
75
85
(1)
Max
15.0
150
250
275
450
125
120
200
5.5
1.1
1.5
2.5
9.0
16
54
18
22
22
65
75
Units
V/ms
mA
mA
mA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
DD
V
V
V
, except that the device is in Sleep
See Figure 14-1
Device in Sleep mode
See Section 8.4 “Power-on
Reset (POR)” for details
See Section 8.4 “Power-on
Reset (POR)” for details
F
F
F
F
F
F
F
V
V
V
V
V
V
V
V
V
comparator enabled)
V
comparator enabled)
2.0V
5.0V
A
OSC
OSC
OSC
OSC
OSC
OSC
OSC
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
≤ +125°C (extended)
© 2007 Microchip Technology Inc.
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 2.0V (per comparator)
= 5.0V (per comparator)
= 2.0V (high range)
= 5.0V (high range)
= 2.0V (reference and 1
= 5.0V (reference and 1
SS
= 4 MHz, V
= 4 MHz, V
= 8 MHz, V
= 8 MHz, V
= 20 MHz, V
= 32 kHz, V
= 32 kHz, V
, T0CKI = V
Conditions
DD
DD
DD
DD
DD
DD
DD
DD
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 2.0V
= 5.0V
, MCLR =
= 5.0V

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