PIC16F526-I/P Microchip Technology, PIC16F526-I/P Datasheet - Page 95

• Manufacturer Part Number: PIC16F526-I/P
• Description: IC PIC MCU FLASH 1KX12 14DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F526-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.5KB (1K x 12)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 11
• Ram Size: 67 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 3x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 67 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 3 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162096 - HEADER MPLAB ICD2 PIC16F526 8/14
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
Preliminary
e
Units
A2
A1
E1
L1
E1
D
N
A
E
e
h
L
c
b
A2
E
MIN
1.25
0.10
0.25
0.40
0.17
0.31
0°
5°
5°
–
L
MILLIMETERS
h
8.65 BSC
1.27 BSC
6.00 BSC
3.90 BSC
1.04 REF
L1
NOM
14
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-065B
h
PIC16F526
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
DS41326A-page 93
c