DSPIC33FJ128MC706-I/PT Microchip Technology, DSPIC33FJ128MC706-I/PT Datasheet - Page 275
![IC DSPIC MCU/DSP 128K 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
DSPIC33FJ128MC706-I/PT
Manufacturer Part Number
DSPIC33FJ128MC706-I/PT
Description
IC DSPIC MCU/DSP 128K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ12GP201-ISO.pdf
(90 pages)
2.DSPIC33FJ64MC506-IPT.pdf
(340 pages)
3.DSPIC33FJ64MC506-IPT.pdf
(30 pages)
4.DSPIC33FJ128GP706-IPT.pdf
(371 pages)
Specifications of DSPIC33FJ128MC706-I/PT
Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
64-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
53
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
16 KB
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Data Rom Size
4096 B
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA330013 - MODULE PLUG-IN DSPIC33 100TQFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ128MC706-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC33FJ12GP201-ISO PDF datasheet
- DSPIC33FJ64MC506-IPT PDF datasheet #2
- DSPIC33FJ64MC506-IPT PDF datasheet #3
- DSPIC33FJ128GP706-IPT PDF datasheet #4
- Current page: 275 of 340
- Download datasheet (5Mb)
26.0
This section provides an overview of dsPIC33FJXXXMCX06/X08/X10 electrical characteristics. Additional information
will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the dsPIC33FJXXXMCX06/X08/X10 family are listed below. Exposure to these maximum
rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any
other conditions above the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................. .-40°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on any combined analog and digital pin and MCLR, with respect to V
Voltage on any digital-only pin with respect to V
Voltage on V
Maximum current out of V
Maximum current into V
Maximum output current sunk by any I/O pin
Maximum output current sourced by any I/O pin
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports
© 2009 Microchip Technology Inc.
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
2: Maximum allowable current is a function of device maximum power dissipation (see Table 26-2).
3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the V
ELECTRICAL CHARACTERISTICS
device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
and PGEDx pins, which are able to sink/source 12 mA.
DD
CAP
with respect to V
/V
DDCORE
DD
SS
with respect to V
pin
pin ...........................................................................................................................300 mA
(2)
...........................................................................................................................250 mA
SS
(1)
......................................................................................................... -0.3V to +4.0V
dsPIC33FJXXXMCX06/X08/X10
(2)
...............................................................................................................200 mA
SS
(3)
....................................................................................... 2.25V to 2.75V
........................................................................................................4 mA
SS
(3)
...................................................................................................4 mA
.................................................................................. -0.3V to +5.6V
SS
......................... -0.3V to (V
REF
+, V
REF
-, SCLx, SDAx, PGECx
DS70287C-page 273
DD
+ 0.3V)
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