C8051F804-GS Silicon Laboratories Inc, C8051F804-GS Datasheet - Page 36

• Manufacturer Part Number: C8051F804-GS
• Description: IC MCU 8BIT 16KB FLASH 16SOIC
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F80xr

Specifications of C8051F804-GS

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Cap Sense, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 13
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (3.9mm Width)
• Processor Series: C8051F8x
• Core: 8051
• Data Bus Width: 16 bit
• Data Ram Size: 512 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F800DK
• Minimum Operating Temperature: - 55 C
• On-chip Adc: 10 bit, 12 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 336-1773-5

C8051F80x-83x
36
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
pad is to be 60 µm minimum, all the way around the pad.
solder paste release.
Components.
Dimension
C
E
X
Y
Table 5.2. QSOP-24 PCB Land Pattern Dimensions
Figure 5.2. QSOP-24 PCB Land Pattern
Rev. 1.0
5.20
0.30
1.50
Min
0.635 BSC
Max
5.30
0.40
1.60