MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 2

• Manufacturer Part Number: MPC5125YVN400
• Description: IC MCU 32BIT E300 324TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC51xxr

Specifications of MPC5125YVN400

• Core Processor: e300
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, USB OTG
• Peripherals: DMA, WDT
• Number Of I /o: 64
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.33 V ~ 1.47 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 324-PBGA
• Processor Series: MPC51xx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
• Maximum Clock Frequency: 400 MHz
• Operating Supply Voltage: 1.4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Data Ram Size: 32 KB
• I/o Voltage: 3.3 V
• Interface Type: CAN, I2C
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 32 bit
• Cpu Speed: 400MHz
• Embedded Interface Type: CAN, I2C, SPI, UART, USB
• Digital Ic Case Style: TEPBGA
• No. Of Pins: 324
• Rohs Compliant: Yes
• Cpu Family: MPC5xx
• Device Core Size: 32b
• Frequency (max): 400MHz
• Total Internal Ram Size: 32KB
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

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2
3
4
2
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
MPC5125 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3.1
3.2
Electrical and Thermal Characteristics . . . . . . . . . . . . . . . . . .36
4.1
4.2
4.3
324-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . . .5
Pin Muxing and Reset States . . . . . . . . . . . . . . . . . . . . .6
3.2.1 Power and Ground Supply Summary . . . . . . . .35
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . .36
4.1.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . .36
4.1.2 Recommended Operating Conditions . . . . . . . .36
4.1.3 DC Electrical Specifications. . . . . . . . . . . . . . . .37
4.1.4 Electrostatic Discharge . . . . . . . . . . . . . . . . . . .40
4.1.5 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . .41
4.1.6 Thermal Characteristics. . . . . . . . . . . . . . . . . . .42
Oscillator and PLL Electrical Characteristics . . . . . . . .43
4.2.1 System Oscillator Electrical Characteristics . . .44
4.2.2 RTC Oscillator Electrical Characteristics . . . . . .44
4.2.3 System PLL Electrical Characteristics. . . . . . . .45
4.2.4 e300 Core PLL Electrical Characteristics . . . . .45
AC Electrical Characteristics. . . . . . . . . . . . . . . . . . . . .46
4.3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
4.3.2 AC Operating Frequency Data. . . . . . . . . . . . . .46
4.3.3 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
4.3.4 External Interrupts . . . . . . . . . . . . . . . . . . . . . . .50
4.3.5 SDRAM (DDR) . . . . . . . . . . . . . . . . . . . . . . . . .50
4.3.6 LPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
MPC5125 Microcontroller Data Sheet, Rev. 3
Table of Contents
5
6
7
8
System Design Information . . . . . . . . . . . . . . . . . . . . . . . . . . 82
5.1
5.2
5.3
5.4
5.5
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
6.1
6.2
Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
4.3.7 NFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.3.8 FEC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.3.9 USB ULPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
4.3.10 MMC/SD/SDIO Card Host Controller (SDHC) . 67
4.3.11 DIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
4.3.12 CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
4.3.13 I
4.3.14 J1850 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
4.3.15 PSC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
4.3.16 GPIOs and Timers . . . . . . . . . . . . . . . . . . . . . . 79
4.3.17 Fusebox . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
4.3.18 IEEE 1149.1 (JTAG) . . . . . . . . . . . . . . . . . . . . . 80
Power Up/Down Sequencing . . . . . . . . . . . . . . . . . . . . 82
System and CPU Core AV
Connection Recommendations . . . . . . . . . . . . . . . . . . 82
Pullup/Pulldown Resistor Requirements . . . . . . . . . . . 83
5.4.1 Pulldown Resistor Requirements for TEST Pin 83
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
5.5.1 JTAG_TRST . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
5.5.2 e300 COP / BDM Interface . . . . . . . . . . . . . . . . 83
Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . 87
Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . 88
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
DD
Power Supply Filtering . 82
Freescale Semiconductor