PIC12F615-I/MS Microchip Technology, PIC12F615-I/MS Datasheet - Page 156

• Manufacturer Part Number: PIC12F615-I/MS
• Description: IC PIC MCU FLASH 1KX14 8MSOP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F615-I/MS

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Number Of I /o: 5
• Program Memory Type: FLASH
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Ram Memory Size: 64Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS-232, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC164325 - MODULE SKT FOR 8MSOPXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC12F609/615/12HV609/615
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body (TSSOP)
DS41302A-page 154
Note:
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Drawing No. C04-086
c
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
b
e
.005" (0.127mm) per side.
See ASME Y14.5M
See ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
n
e
L
c
b
MIN
L
.031
.002
.169
.018
.004
.007
.114
Preliminary
0°
–
INCHES
.026 BSC
.252 BSC
12° REF
12° REF
NOM
2
1
.039
.173
.024
.118
D
8
–
–
–
–
–
MAX
.047
.041
.006
.177
.122
.030
.008
.012
8°
A1
A
MIN
0.80
0.05
4.30
2.90
0.45
0.09
0.19
0°
–
© 2006 Microchip Technology Inc.
MILLIMETERS*
0.65 BSC
6.40 BSC
12° REF
12° REF
NOM
1.00
4.40
3.00
0.60
Revised 7-25-06
8
–
–
–
–
–
MAX
A2
1.20
1.05
0.15
4.50
3.10
0.75
0.20
0.30
8°