PIC12F615-I/MS Microchip Technology, PIC12F615-I/MS Datasheet - Page 156
![IC PIC MCU FLASH 1KX14 8MSOP](/photos/6/59/65932/mfg_150_c04-111_ms_8-msop_sml.jpg)
PIC12F615-I/MS
Manufacturer Part Number
PIC12F615-I/MS
Description
IC PIC MCU FLASH 1KX14 8MSOP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(26 pages)
3.PIC12F609T-ISN.pdf
(8 pages)
4.PIC12F615-ESN.pdf
(168 pages)
Specifications of PIC12F615-I/MS
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Number Of I /o
5
Program Memory Type
FLASH
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
64Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC164325 - MODULE SKT FOR 8MSOPXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F615-I/MS
Manufacturer:
RICHTEK
Quantity:
5 400
Part Number:
PIC12F615-I/MS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC12F609/615/12HV609/615
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body (TSSOP)
DS41302A-page 154
Note:
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Drawing No. C04-086
c
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
b
e
.005" (0.127mm) per side.
See ASME Y14.5M
See ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
n
e
L
c
b
MIN
L
.031
.002
.169
.018
.004
.007
.114
Preliminary
0°
–
INCHES
.026 BSC
.252 BSC
12° REF
12° REF
NOM
2
1
.039
.173
.024
.118
D
8
–
–
–
–
–
MAX
.047
.041
.006
.177
.122
.030
.008
.012
8°
A1
A
MIN
0.80
0.05
4.30
2.90
0.45
0.09
0.19
0°
–
© 2006 Microchip Technology Inc.
MILLIMETERS*
0.65 BSC
6.40 BSC
12° REF
12° REF
NOM
1.00
4.40
3.00
0.60
Revised 7-25-06
8
–
–
–
–
–
MAX
A2
1.20
1.05
0.15
4.50
3.10
0.75
0.20
0.30
8°