PIC16F716-I/SS Microchip Technology, PIC16F716-I/SS Datasheet - Page 329
PIC16F716-I/SS
Manufacturer Part Number
PIC16F716-I/SS
Description
IC PIC MCU FLASH 2KX14 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F716-ISO.pdf
(136 pages)
4.PIC16F716-ISO.pdf
(12 pages)
5.PIC16F716-ESO.pdf
(126 pages)
Specifications of PIC16F716-I/SS
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPI3-DB16F716 - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPAC162054 - HEADER INTERFACE ICD2 16F716AC164018 - MODULE SKT PROMATEII 20SSOP
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F716-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F716-ISO PDF datasheet #3
- PIC16F716-ISO PDF datasheet #4
- PIC16F716-ESO PDF datasheet #5
- Current page: 329 of 688
- Download datasheet (3Mb)
17.4.18.2 Bus Collision During a Repeated Start Condition
1997 Microchip Technology Inc.
SDA
SCL
RSEN
BCLIF
S
SSPIF
During a Repeated Start condition, a bus collision occurs if:
a)
b)
When the user de-asserts SDA and the pin is allowed to float high, the BRG is loaded with
SSPADD<6:0>, and counts down to zero. The SCL pin is then de-asserted, and when sampled
high, the SDA pin is sampled. If SDA is low, a bus collision has occurred (i.e. another master,
Figure
is reloaded and begins counting. If SDA goes from high to low before the BRG times out, no bus
collision occurs, because no two masters can assert SDA at exactly the same time.
If, however, SCL goes from high to low before the BRG times out and SDA has not already been
asserted, then a bus collision occurs. In this case, another master is attempting to transmit a data
’1’ during the Repeated Start condition,
If at the end of the BRG time out both SCL and SDA are still high, the SDA pin is driven low, the
BRG is reloaded, and begins counting. At the end of the count, regardless of the status of the
SCL pin, the SCL pin is driven low and the Repeated Start condition is complete.
Figure 17-38: Bus Collision During a Repeated Start Condition (Case 1)
A low level is sampled on SDA when SCL goes from low level to high level.
SCL goes low before SDA is asserted low, indicating that another master is attempting to
transmit a data ’1’.
17-38, is attempting to transmit a data ’0’). If, however, SDA is sampled high then the BRG
Preliminary
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL
Figure
17-39.
Section 17. MSSP
Cleared in software
'0'
'0'
DS31017A-page 17-53
17
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