PIC16F883-I/ML Microchip Technology, PIC16F883-I/ML Datasheet - Page 208
![IC PIC MCU FLASH 4KX14 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC16F883-I/ML
Manufacturer Part Number
PIC16F883-I/ML
Description
IC PIC MCU FLASH 4KX14 28QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
Specifications of PIC16F883-I/ML
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC16F
No. Of I/o's
24
Eeprom Memory Size
256Byte
Ram Memory Size
256Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
MSSP, EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164120-3
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Package
28QFN EP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Operating Supply Voltage
2.5|3.3|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP1631RD-MCC2 - REFERENCE DESIGN MCP1631HVXLT28QFN4 - SOCKET TRANS ICE 28QFN W/CABLEAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F883-I/ML
Manufacturer:
MICROCHIP
Quantity:
1 200
- PIC16F616T-ISL PDF datasheet
- MCP1631RD-MCC2 PDF datasheet #2
- PIC16F882-ISS PDF datasheet #3
- PIC16F882-ISS PDF datasheet #4
- Current page: 208 of 328
- Download datasheet (6Mb)
PIC16F882/883/884/886/887
13.4.16.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user de-asserts SDA and the pin is allowed
to float high, the BRG is loaded with SSPADD<6:0>
and counts down to 0. The SCL pin is then de-asserted,
and when sampled high, the SDA pin is sampled.
FIGURE 13-24:
FIGURE 13-25:
DS41291F-page 206
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low, indi-
cating that another master is attempting to trans-
mit a data ’1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
Set BCLIF, release SDA and SCL
T
BRG
Sample SDA when SCL goes high,
If SDA = 0, set BCLIF and release SDA and SCL
If SDA is low, a bus collision has occurred (i.e, another
master is attempting to transmit a data ‘0’, see
Figure 13-24). If SDA is sampled high, the BRG is
reloaded and begins counting. If SDA goes from high-
to-low before the BRG times out, no bus collision
occurs because no two masters can assert SDA at
exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition
(Figure 13-25).
If at the end of the BRG time-out, both SCL and SDA are
still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is complete.
T
Cleared in software
© 2009 Microchip Technology Inc.
BRG
Interrupt cleared
in software
‘0’
‘0’
‘
0
’
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