DSPIC30F2010-20E/SP Microchip Technology, DSPIC30F2010-20E/SP Datasheet - Page 188

• Manufacturer Part Number: DSPIC30F2010-20E/SP
• Description: IC DSPIC MCU/DSP 12K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2010-20E/SP

• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

dsPIC30F2010
28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body [QFN-S]
With 0.40 mm Contact Length
DS70118G-page 186
Note:
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
D
N
Dimension Limits
2
A1
1
EXPOSED
E
A
Microchip Technology Drawing No. C04–124, Sept. 8, 2006
NOTE 1
Units
PAD
A1
A3
E2
D2
E2
N
A
E
D
K
e
b
L
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.30
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.38
0.40
28
—
D2
MAX
1.00
0.05
4.70
4.70
0.43
0.50
© 2006 Microchip Technology Inc.
—
L
b
e
K