PIC24FJ64GB002-I/ML Microchip Technology, PIC24FJ64GB002-I/ML Datasheet - Page 200

• Manufacturer Part Number: PIC24FJ64GB002-I/ML
• Description: IC MCU 16BIT 64KB FLASH 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24FJ64GB002-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 19
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/IrDA/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 19
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9-ch x 10-bit
• Controller Family/series: PIC24
• Ram Memory Size: 8KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Embedded Interface Type: I2C, LIN, SPI, UART, USB
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24FJ64GB004 FAMILY
18.1.2
18.1.2.1
PIC24FJ64GB004 family devices have built-in 15 k
pull-down resistor on the D+ and D- lines. These are
used in tandem to signal to the bus that the microcon-
troller is operating in Host mode. They are engaged by
setting the HOSTEN bit (U1CON<3>). If the OTGEN bit
(U1OTGCON<2>) is set, then these pull-downs are
enabled by setting the DPPULDWN and DMPULDWN
bits (U1OTGCON<5:4>).
18.1.2.2
In Host mode, as well as Host mode in On-the-Go
operation, the USB 2.0 specification requires that the
Host application supply power on V
FIGURE 18-6:
FIGURE 18-7:
DS39940D-page 200
HOST AND OTG MODES
D+ and D- Pull-down Resistors
Power Configurations
Connector
Micro A/B
Connector
Micro A/B
V
GND
BUS
D+
HOST INTERFACE EXAMPLE
OTG INTERFACE EXAMPLE
D-
V
ID
GND
BUS
D+
D-
ID
4.7 µF
150 µF
BUS
1 µF
40 k
. Since the
Thermal Fuse
Polymer PTC
2 k
2 k
GND
C+
C-
V
OUT
MCP1253
SELECT
PGOOD
SHND
+5V
0.1 µF,
3.3V
V
IN
microcontroller is running below V
source sufficient current, a separate power supply must
be provided.
When the application is always operating in Host mode,
a simple circuit can be used to supply V
late current on the bus (Figure 18-6). For OTG opera-
tion, it is necessary to be able to turn V
needed, as the microcontroller switches between
Device and Host modes. A typical example using an
external charge pump is shown in Figure 18-7.
+3.3V +3.3V
V
DD
10 µF
V
V
A/D pin
V
D+
D-
ID
V
USB
PIC
DD
BUS
SS
I/O
I/O
V
D+
D-
ID
V
PIC
BUS
SS
®
Microcontroller
®
Microcontroller
 2010 Microchip Technology Inc.
BUS
and is not able to
BUS
BUS
on or off as
and regu-