PIC24FJ64GB002-I/ML Microchip Technology, PIC24FJ64GB002-I/ML Datasheet - Page 307

• Manufacturer Part Number: PIC24FJ64GB002-I/ML
• Description: IC MCU 16BIT 64KB FLASH 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24FJ64GB002-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 19
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/IrDA/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 19
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9-ch x 10-bit
• Controller Family/series: PIC24
• Ram Memory Size: 8KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Embedded Interface Type: I2C, LIN, SPI, UART, USB
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TABLE 29-1:
TABLE 29-2:
 2010 Microchip Technology Inc.
PIC24FJ64GB004 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 300 mil SOIC
Package Thermal Resistance, 6x6x0.9 mm QFN
Package Thermal Resistance, 8x8x1 mm QFN
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
P
P
INT
I
/
O
Junction to ambient thermal resistance; Theta-
=  ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
x (I
DD
DD
– V
Characteristic
OH
–  I
} x I
Rating
OH
OH
)
) +  (V
OL
x I
OL
PIC24FJ64GB004 FAMILY
)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX




P
T
T
JA
JA
JA
JA
A
D
J
33.7
39.3
Min
Typ
-40
-40
49
28
(T
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
+ P
A
)/
I
/
O
JA
DS39940D-page 307
+140
+125
°C/W
°C/W
°C/W
°C/W
Max
Unit
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W