PIC18F252-E/SO Microchip Technology, PIC18F252-E/SO Datasheet - Page 6

IC MCU CMOS 40MHZ 16K FLSH28SOIC

PIC18F252-E/SO

Manufacturer Part Number
PIC18F252-E/SO
Description
IC MCU CMOS 40MHZ 16K FLSH28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F252-E/SO

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
23
Eeprom Memory Size
256Byte
Ram Memory Size
1.5KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
MSSP, SPI, I2C, PSP, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
23
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F252-E/SO
Manufacturer:
MICROCHIP
Quantity:
53
PIC18FXX2
2. Module: Packaging (Pinout and Product
1.
2.
FIGURE 1:
FIGURE 2:
DS80150D-page 6
PIC18F442 and PICF452 devices are now offered
in 44-pin, near chip-scale micro lead frame
packages (commonly known as “QFN”). This
packaging type has been added to the product line
since the latest revision of the Device Data Sheet.
The addition of this option requires the following
additions to the Device Data Sheet (DS39564B).
The referenced figures and tables follow this text.
The “Pin Diagrams” on pages 2-3 of the Data
Sheet are amended with the addition of the
44-pin QFN pinout, shown in Figure 1.
Table 1-3
replaced with an updated version which adds a
column for QFN pin assignments. A row is also
added for previously unlisted NC pins. All new
information is indicated in bold.
Identification)
of
QFN
PINOUT DIAGRAM FOR PIC18F442/452, 44-PIN QFN PACKAGE
PACKAGE MARKING TEMPLATE FOR PIC18F442/452, 44-PIN QFN
Section 1.0
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
RC7/RX/DT
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
RB0/INT0
RB1/INT1
RB2/INT2
“Overview”
V
V
V
DD
DD
SS
1
2
3
4
5
6
7
8
9
10
11
is
PIC18F442
PIC18F452
3.
4.
5.
Section 24.1 “Package Marking Information”
is amended to include a marking template and
example for 44-pin QFN devices. These are
shown in Figure 2.
Section 24.2 “Package Details” is amended to
include the mechanical drawing of the 44-pin
QFN package following the existing drawings,
shown in Figure 3.
In the “PIC18F442/452 Product Identification
System” (page 329), the “Package” options are
amended to include the new line item:
ML = QFN
For the sake of completeness, it is also noted that
the package designation “MLF” is now replaced by
“QFN” in all occurrences throughout the Device
Data Sheet. “MLF” should be considered an
obsoleted term.
33
32
31
30
29
28
27
26
25
24
23
Example
PIC18F442
-I/ML
0510017
OSC2/CLKO/RA6
OSC1/CLKI
V
V
V
V
RE2/AN7/CS
RE1/AN6/WR
RE0/AN5/RD
RA5/AN4/SS/LVDIN
RA4/T0CKI
SS
SS
DD
DD
© 2005 Microchip Technology Inc.

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