DSPIC33FJ128MC802-I/SO Microchip Technology, DSPIC33FJ128MC802-I/SO Datasheet - Page 373
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DSPIC33FJ128MC802-I/SO
Manufacturer Part Number
DSPIC33FJ128MC802-I/SO
Description
IC DSPIC MCU/DSP 128K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
2.DSPIC33FJ32MC302-ISO.pdf
(436 pages)
3.DSPIC33FJ64MC202-ESO.pdf
(424 pages)
Specifications of DSPIC33FJ128MC802-I/SO
Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
16 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC302-ISO PDF datasheet #2
- DSPIC33FJ64MC202-ESO PDF datasheet #3
- Current page: 373 of 436
- Download datasheet (6Mb)
TABLE 31-36: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING
© 2011 Microchip Technology Inc.
AC CHARACTERISTICS
SP70
SP72
SP73
SP30
SP31
SP35
SP36
SP40
SP41
SP50
SP51
SP52
SP60
Note 1:
Param
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
No.
2:
3:
4:
TscP
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdoV2scH,
TdoV2scL
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ
TscH2ssH
TscL2ssH
TssL2doV SDOx Data Output Valid after
Symbol
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must
not violate this specificiation.
Assumes 50 pF load on all SPIx pins.
REQUIREMENTS
Maximum SCK Input Frequency
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SSx ↓ to SCKx ↑ or SCKx Input
SSx ↑ to SDOx Output
High-Impedance
SSx after SCKx Edge
SSx Edge
Characteristic
(4)
(1)
1.5 T
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
120
CY
30
30
30
10
—
—
—
—
—
—
—
+ 40
Typ
—
—
—
—
—
—
—
—
—
—
—
—
6
(2)
Max
15
20
50
50
—
—
—
—
—
—
—
—
—
-40°C ≤ T
-40°C ≤ T
Units
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
See Note 3
See parameter
and Note 4
See parameter
and Note 4
See parameter
and Note 4
See parameter
and Note 4
See Note 4
DS70291E-page 373
Conditions
—
—
—
—
—
—
—
DO32
DO31
DO32
DO31
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