DSPIC33FJ128MC802-I/SO Microchip Technology, DSPIC33FJ128MC802-I/SO Datasheet - Page 402
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DSPIC33FJ128MC802-I/SO
Manufacturer Part Number
DSPIC33FJ128MC802-I/SO
Description
IC DSPIC MCU/DSP 128K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
2.DSPIC33FJ32MC302-ISO.pdf
(436 pages)
3.DSPIC33FJ64MC202-ESO.pdf
(424 pages)
Specifications of DSPIC33FJ128MC802-I/SO
Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
16 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC302-ISO PDF datasheet #2
- DSPIC33FJ64MC202-ESO PDF datasheet #3
- Current page: 402 of 436
- Download datasheet (6Mb)
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
TABLE 32-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 32-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
DS70291E-page 402
HSP35
HSP40
HSP41
HSP51
HSP60
Note 1:
CHARACTERISTICS
HSP35
HSP40
HSP41
HSP51
Note 1:
CHARACTERISTICS
Param
Param
No.
No.
2:
2:
AC
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ
AC
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ SSx ↑ to SDO
TssL2doV
Symbol
Symbol
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input to
SCKx Edge
SSx ↑ to SDOx Output
High-Impedance
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
High-Impedance
SDOx Data Output Valid after
SSx Edge
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
Characteristic
Characteristic
X
Output
(1)
(1)
-40°C ≤ T
-40°C ≤ T
A
Min
Min
A
—
25
25
15
25
25
15
—
—
≤ +150°C for High Temperature
≤ +150°C for High Temperature
Typ
Typ
—
—
—
—
—
—
—
—
—
Max
Max
35
—
—
55
35
55
55
—
—
Units
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
© 2011 Microchip Technology Inc.
See Note 2
See Note 2
Conditions
Conditions
—
—
—
—
—
—
—
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