PIC18F8680-E/PT Microchip Technology, PIC18F8680-E/PT Datasheet - Page 3

• Manufacturer Part Number: PIC18F8680-E/PT
• Description: IC PIC MCU FLASH 32KX16 80TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F8680-E/PT

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.25K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-TFQFP
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3328 B
• Interface Type: I2C, SPI, AUSART, CAN
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 69
• Number Of Timers: 8
• Operating Supply Voltage: 4.2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11. Module: Enhanced Controller Area
12. Module: EUSART
13. Module: External Memory Interface
© 2007 Microchip Technology Inc.
Bit ERRIF in the PIR3 register is incorrectly set
when a message is received in Mode 2. This may
incorrectly indicate an error condition on the bus.
When ERRIF is incorrectly set, a sequence of
steps must be followed to clear the incorrect
ERRIF flag.
Work around
To determine the correct error state, do the
following checks:
1. If any of the COMSTAT<5:0> bits are non-zero,
2. Otherwise, an error did not occur.
To remove the incorrect error state, do the
following:
1. Clear FIFOEMPTY bit.
2. Clear ERRIF bit.
Date Codes that pertain to this issue:
All engineering and production devices.
Bit SENDB in the TXSTA register is not
automatically
completion of transmission of a Sync Break.
Work around
Check the TRMT bit in TXSTA. If TRMT bit is set,
Break transmission is said to be complete.
Date Codes that pertain to this issue:
All engineering and production devices.
When performing writes on the external memory
interface, a short glitch is present on the LB and
UB lines. The length of the glitch is proportional to
F
perature. The glitch occurs well before the WRH
signal is asserted and no adverse affect on the
operation of the external memory interface has
been observed.
Work around
None.
Date Codes that pertain to this issue:
All engineering and production devices.
OSC
an error condition has occurred.
and may vary with process, voltage and tem-
Network (ECAN™ Technology)
cleared
by
hardware
PIC18F6585/6680/8585/8680
upon
14. Module: Core
Certain combinations of code sequence, code
placement, V
cause a corrupted read of fetched instructions or
data. A corrupted instruction fetch will cause the
part to execute an incorrect instruction with
unpredictable results.
Microchip cannot predict which combinations of
these conditions will cause this failure.
If this failure mechanism exists in your system, it
should become evident during statistically signifi-
cant preproduction testing, using your particular
code sequence and placement, across multiple
date codes. Preproduction testing should exercise
all the functions of your application across system
variables. Any changes to code should be tested in
the same manner prior to being implemented.
Work around
• Try changing the placement of code within
In each of these instances, the literal data behaves
as a NOP instruction when it is executed. Using the
actual NOP instruction instead of a literal FFFFh
may not have the same results.
After making any of the changes described above,
it is necessary that you do statistically significant
preproduction testing, using your new code
sequence and placement, across multiple date
codes. Preproduction testing should exercise all
the functions of your application across system
variables.
• Contact your nearest Microchip sales office for
Date Codes that pertain to this issue:
All engineering and production devices.
program memory. Examples of code placement
changes include:
additional help.
• Insert a data word of value FFFFh
• Insert a data word of value FFFFh as the
• Insert a data word of FFFFh at the interrupt
• Insert a data word of value FFFFh immedi-
immediately following any table read
instruction
first instruction in the destination of a CALL
or GOTO
vector address(es) (0008h and/or 0018h)
ately following any RETURN, RETLW, or
RETFIE instruction
DD
, F
OSC
and temperature may
DS80162E-page 3