PIC18F4685-I/PT Microchip Technology, PIC18F4685-I/PT Datasheet - Page 6

• Manufacturer Part Number: PIC18F4685-I/PT
• Description: IC PIC MCU FLASH 48KX16 44TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F4685-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 96KB (48K x 16)
• Package / Case: 44-TQFP, 44-VQFP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 36
• Eeprom Size: 1K x 8
• Ram Size: 3.25K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3328 B
• Interface Type: EUSART, I2C, MSSP, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Number Of Timers: 4
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 11 Channel
• Package: 44TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPI3-DB18F4680 - BOARD DAUGHTER ICEPIC3AC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2682/2685/4682/4685
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 131
11.0 Timer0 Module ......................................................................................................................................................................... 149
12.0 Timer1 Module ......................................................................................................................................................................... 153
13.0 Timer2 Module ......................................................................................................................................................................... 159
14.0 Timer3 Module ......................................................................................................................................................................... 161
15.0 Capture/Compare/PWM (CCP1) Modules ............................................................................................................................... 165
16.0 Enhanced Capture/Compare/PWM (ECCP1) Module.............................................................................................................. 175
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 189
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 229
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 249
20.0 Comparator Module.................................................................................................................................................................. 259
21.0 Comparator Voltage Reference Module ................................................................................................................................... 265
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 269
23.0 ECAN™ Technology ................................................................................................................................................................ 275
24.0 Special Features of the CPU .................................................................................................................................................... 345
25.0 Instruction Set Summary .......................................................................................................................................................... 365
26.0 Development Support............................................................................................................................................................... 415
27.0 Electrical Characteristics .......................................................................................................................................................... 419
28.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 455
29.0 Packaging Information.............................................................................................................................................................. 457
Appendix A: Revision History............................................................................................................................................................. 465
Appendix B: Device Differences......................................................................................................................................................... 465
Appendix C: Conversion Considerations ........................................................................................................................................... 466
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 466
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 467
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 467
The Microchip Web Site ..................................................................................................................................................................... 481
Customer Change Notification Service .............................................................................................................................................. 481
Customer Support .............................................................................................................................................................................. 481
Reader Response .............................................................................................................................................................................. 482
PIC18F2682/2685/4682/4685 Product Identification System ............................................................................................................ 483
DS39761C-page 6
Device Overview .......................................................................................................................................................................... 9
Oscillator Configurations ............................................................................................................................................................ 25
Power-Managed Modes ............................................................................................................................................................. 35
Reset .......................................................................................................................................................................................... 43
Memory Organization ................................................................................................................................................................. 63
Flash Program Memory .............................................................................................................................................................. 97
Data EEPROM Memory ........................................................................................................................................................... 107
8 x 8 Hardware Multiplier.......................................................................................................................................................... 113
Interrupts .................................................................................................................................................................................. 115
© 2009 Microchip Technology Inc.