STM32F103C6U6A STMicroelectronics, STM32F103C6U6A Datasheet - Page 81

• Manufacturer Part Number: STM32F103C6U6A
• Description: MCU 32BIT ARM 32K FLASH 48-QFN
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103C6U6A

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 37
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 10K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 10 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 6
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 10 Channel
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F103x4, STM32F103x6
6.2
6.2.1
Thermal characteristics
The maximum chip junction temperature (T
Table 9: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 56.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Symbol
I/O
Θ
JA
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
Thermal resistance junction-ambient
TFBGA64 - 5 × 5 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 48 -7 × 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 × 6 mm / 0.5 mm pitch
max is the product of I
Package thermal characteristics
OL
× I
OL
T
INT
) + Σ((V
J
Doc ID 15060 Rev 5
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
A
– V
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
32.
/ I
OH
D
OH
),
max × Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Package characteristics
max + P
Value
65
45
55
16
18
I/O
max),
°C/W
Unit
81/87