ST72C334J2T6 STMicroelectronics, ST72C334J2T6 Datasheet - Page 126
![MCU 8BIT FLASH SPI SCI 44TQFP](/photos/6/84/68458/497-44-tqfp_44-lqfp_sml.jpg)
ST72C334J2T6
Manufacturer Part Number
ST72C334J2T6
Description
MCU 8BIT FLASH SPI SCI 44TQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST72C124J2T6.pdf
(153 pages)
Specifications of ST72C334J2T6
Core Processor
ST7
Core Size
8-Bit
Speed
16MHz
Connectivity
SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
3.2 V ~ 5.5 V
Data Converters
A/D 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Processor Series
ST72C3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
32
Number Of Timers
4 bit
Operating Supply Voltage
3.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7C334-INDART, ST7MDT2-EPB2/US
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-4837
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST72C334J2T6
Manufacturer:
analogic
Quantity:
3 188
Company:
Part Number:
ST72C334J2T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
ST72334J/N, ST72314J/N, ST72124J
EMC CHARACTERISTICS (Cont’d)
16.7.3 ESD Pin Protection Strategy
To protect an integrated circuit against Electro-
Static Discharge the stress must be controlled to
prevent degradation or destruction of the circuit el-
ements. The stress generally affects the circuit el-
ements which are connected to the pads but can
also affect the internal devices when the supply
pads receive the stress. The elements to be pro-
tected must not receive excessive current, voltage
or heating within their structure.
An ESD network combines the different input and
output ESD protections. This network works, by al-
lowing safe discharge paths for the pins subjected
to ESD stress. Two critical ESD stress cases are
presented in
pins and in
drain pins.
Figure 77. Positive Stress on a Standard Pad vs. V
Figure 78. Negative Stress on a Standard Pad vs. V
126/153
Main path
Path to avoid
Main path
Figure 79
Figure 77
V
V
V
V
DD
DD
SS
SS
and
and
Figure 80
Figure 78
(3a)
(3b)
(3a)
(3b)
for true open
for standard
OUT
OUT
SS
Standard Pin Protection
To protect the output structure the following ele-
ments are added:
To protect the input structure the following ele-
ments are added:
DD
– A diode to V
– A protection device between V
– A resistor in series with the pad (1)
– A diode to V
– A protection device between V
(4)
(4)
IN
IN
DD
DD
(3a) and a diode from V
(2a) and a diode from V
(2a)
(2b)
(2a)
(2b)
(1)
(1)
DD
DD
and V
and V
SS
SS
SS
SS
V
V
V
V
DD
SS
DD
SS
(3b)
(2b)
(4)
(4)