STM32F105R8T6 STMicroelectronics, STM32F105R8T6 Datasheet - Page 49

MCU ARM 64KB FLASH MEM 64-LQFP

STM32F105R8T6

Manufacturer Part Number
STM32F105R8T6
Description
MCU ARM 64KB FLASH MEM 64-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F105R8T6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
51
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F105x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
20 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
10
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit x 2, 16 Channel
On-chip Dac
12 bit x 2, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
20KB
# I/os (max)
51
Number Of Timers - General Purpose
7
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
For Use With
497-10591 - DAUGHTER BOARD FOR STM32497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8922

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STM32F105xx, STM32F107xx
5.3.7
Internal clock source characteristics
The parameters given in
temperature and V
High-speed internal (HSI) RC oscillator
Table 24.
1. V
2. Refer to application note AN2868 “STM32F10xxx internal RC oscillator (HSI) calibration” available from the
3. Guaranteed by design, not tested in production.
4. Based on characterization, not tested in production.
Low-speed internal (LSI) RC oscillator
Table 25.
1. V
2. Based on characterization, not tested in production.
3. Guaranteed by design, not tested in production.
Wakeup time from low-power mode
The wakeup times given in
oscillator. The clock source used to wake up the device depends from the current operating
mode:
I
t
DD(HSI)
Symbol
ACC
su(HSI)
I
ST website www.st.com.
t
Symbol
DD(LSI)
f
su(LSI)
DD
DD
HSI
f
Stop or Standby mode: the clock source is the RC oscillator
Sleep mode: the clock source is the clock that was set before entering Sleep mode.
LSI
HSI
= 3.3 V, T
= 3 V, T
(4)
(2)
(4)
(3)
(3)
Frequency
Accuracy of the HSI
oscillator
HSI oscillator
startup time
HSI oscillator
power consumption
HSI oscillator characteristics
LSI oscillator characteristics
A
A
= –40 to 105 °C unless otherwise specified.
Frequency
LSI oscillator startup time
LSI oscillator power consumption
Parameter
= –40 to 105 °C unless otherwise specified.
DD
supply voltage conditions summarized in
Table 24
Table 26
Parameter
Doc ID 15274 Rev 5
User-trimmed with the RCC_CR
register
Factory-
calibrated
are derived from tests performed under ambient
is measured on a wakeup phase with a 8-MHz HSI RC
(2)
(4)
Conditions
(1)
(1)
T
T
T
T
A
A
A
A
= –40 to 105 °C
= –10 to 85 °C
= 0 to 70 °C
= 25 °C
Min
30
Table
Electrical characteristics
–1.5
–1.3
–1.1
Min
–2
1
0.65
Typ
40
9.
Typ
80
8
Max
1.2
60
85
Max
100
1
2.5
2.2
1.8
2
2
(3)
Unit
kHz
49/101
MHz
µA
Unit
µs
µA
µs
%
%
%
%
%

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