STM32F105R8T6 STMicroelectronics, STM32F105R8T6 Datasheet - Page 74

MCU ARM 64KB FLASH MEM 64-LQFP

STM32F105R8T6

Manufacturer Part Number
STM32F105R8T6
Description
MCU ARM 64KB FLASH MEM 64-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F105R8T6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
51
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F105x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
20 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
10
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit x 2, 16 Channel
On-chip Dac
12 bit x 2, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
20KB
# I/os (max)
51
Number Of Timers - General Purpose
7
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
For Use With
497-10591 - DAUGHTER BOARD FOR STM32497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8922

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Electrical characteristics
74/101
Figure 34. ADC accuracy characteristics
Figure 35. Typical connection diagram using the ADC
1. Refer to
2. C
4095
4094
4093
pad capacitance (roughly 7 pF). A high C
this, f
7
6
5
4
3
2
1
parasitic
0
V
SSA
[1LSB
ADC
1
Table 51
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
E
should be reduced.
IDEAL
O
V AIN
2
=
V
4096
3
for the values of R
REF+
R AIN (1)
4
(or
C parasitic
V
5
1 LSB
4096
DDA
E
AINx
6
T
depending on package)]
IDEAL
Doc ID 15274 Rev 5
E
AIN
7
L
(2)
, R
parasitic
ADC
E
V DD
D
and C
4093 4094 4095 4096
(3)
0.6 V
0.6 V
value will downgrade conversion accuracy. To remedy
V T
V T
ADC
(1)
.
E
I L ±1 µA
G
V
DDA
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
Sample and hold ADC
converter
R ADC (1)
T
O
G
D
L
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
=Differential Linearity Error: maximum deviation
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
STM32F105xx, STM32F107xx
C ADC (1)
converter
12-bit
STM32F10xxx
ai14139d
ai14395b

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