STR910FAZ32H6 STMicroelectronics, STR910FAZ32H6 Datasheet - Page 45

• Manufacturer Part Number: STR910FAZ32H6
• Description: MCU 256KB FLASH 64K RAM 144LFBGA
• Manufacturer: STMicroelectronics
• Series: STR9r

Specifications of STR910FAZ32H6

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 2 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFBGA
• Processor Series: STR910x
• Core: ARM966E-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, IrDA, SSP, UART
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR9-COMSTICK, STR910-EVAL, STR91X-SK/HIT, STR91X-SK/IAR, STR91X-SK/KEI, STR91X-SK/RAI, STR9-DK/RAIS, STR91X-DK/IAR, STX-PRO/RAIS, STR912-D/RAIS, STR79-RVDK/CPP, STR79-RVDKCPP/9, STR79-RVDK, STR79-RVDK/9, STR9-RVDK/BAS, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: 497-8268 - BOARD EVAL FOR EVAL-STR910MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES497-5067 - BOARD EVAL FOR STR910 FAMILY497-5066 - KIT STARTER KEIL FOR STR910497-5065 - KIT STARTER IAR KICKSTART STR912497-5064 - KIT STARTER FOR STR910 FAMILY497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-6277

STR91xFAxxx
5.1
Table 7.
1.
2.
3.
10
11
12
1
2
3
4
5
6
7
8
9
No PHYCLK function on STR910F
No USBCLK function on STR910F
NU (Not Used) on STR910FAW devices. D10 is not connected, C11 must be pulled up by a 1.5 kOhm resistor to VDDQ.
RESET_
X1_CPU
X2_CPU
AVREF
AVDD
VSSQ
JTMS
OUTn
EMI_
WEn
P4.2
P4.6
P7.7
P1.5
A
LFBGA144 ball connections
●
●
●
STR91x LFBGA144 ball connections
PLLVSSQ
JRTCK
VDDQ
JTDO
P7.2
P4.1
P4.3
P4.5
P1.4
P1.2
P1.0
P0.7
B
In
future devices and should NOT be connected to ground or any other signal. There are
total of 9 NC (no connection) balls.
Balls H1 and G4 are assigned as EMI bus write signals (EMI_BWR_WRLn and
EMI_WRHn). These two balls can also be configured by the user as EMI low or high
byte select signals (EMI_LBn and EMI_UBn).
The PLLGND (B8) and PLLVDDQ (C9) balls can be connected to VSSQ and VDDQ.
Table 7
PLLVDDQ
USBDP
RESET_
VSSQ
AVSS
P4.0
P4.4
JTDI
P1.3
P1.1
NC
NC
INn
C
A
A
(2)
balls labelled NC are no connect balls. These NC balls are reserved for
W devices.
W devices.
USBDN
MDIO
JRSTn
VDDQ
VSSQ
VDD
P7.0
P7.1
P4.7
P1.7
MII_
P6.7
NC
D
(3)
(3)
TAMPER_
VDDQ
JTCK
P2.0
P2.1
P5.0
P7.5
P7.6
P6.6
P0.6
VSS
NC
IN
E
Doc ID 13495 Rev 6
VDDQ
VSSQ
P7.3
VSS
VDD
P5.1
P1.6
P0.5
NC
NC
NC
NC
F
EMI_BWR_
(EMI_LBn)
WRLn
VSSQ
VDD
P7.4
P6.2
P6.3
P2.6
P6.5
P6.4
VSS
P5.7
NC
G
EMI_WRHn
(EMI_UBn)
EMI_BAAn
VDDQ
P8.1
P6.0
P5.6
P0.4
P5.5
P0.3
P5.3
VSS
P9.4
H
VDDQ
VSSQ
EMI_
EMI_
P8.2
P6.1
P8.5
P2.5
P9.3
P3.3
P0.2
P5.4
RDn
ALE
J
PHYCLK_
P5.2
WAITn
VDDQ
VSSQ
EMI_
P8.7
P8.3
P2.3
P9.2
P3.0
P9.7
P0.1
P3.7
K
(1)
Pin description
USBCLK_
P2.7
VSSQ
VDDQ
VSSQ
P8.0
P8.4
P2.4
VDD
P9.5
P3.4
P3.5
P0.0
L
(2)
45/102
VBATT
BCLK
EMI_
P2.2
P8.6
RTC
RTC
P9.0
P9.1
P9.6
P3.1
P3.2
P3.6
X2_
X1_
M