STR910FAZ32H6 STMicroelectronics, STR910FAZ32H6 Datasheet - Page 64

• Manufacturer Part Number: STR910FAZ32H6
• Description: MCU 256KB FLASH 64K RAM 144LFBGA
• Manufacturer: STMicroelectronics
• Series: STR9r

Specifications of STR910FAZ32H6

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 2 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFBGA
• Processor Series: STR910x
• Core: ARM966E-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, IrDA, SSP, UART
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR9-COMSTICK, STR910-EVAL, STR91X-SK/HIT, STR91X-SK/IAR, STR91X-SK/KEI, STR91X-SK/RAI, STR9-DK/RAIS, STR91X-DK/IAR, STX-PRO/RAIS, STR912-D/RAIS, STR79-RVDK/CPP, STR79-RVDKCPP/9, STR79-RVDK, STR79-RVDK/9, STR9-RVDK/BAS, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: 497-8268 - BOARD EVAL FOR EVAL-STR910MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES497-5067 - BOARD EVAL FOR STR910 FAMILY497-5066 - KIT STARTER KEIL FOR STR910497-5065 - KIT STARTER IAR KICKSTART STR912497-5064 - KIT STARTER FOR STR910 FAMILY497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-6277

Electrical characteristics
7.6
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Supply current characteristics
V
Table 15.
1. ARM core and peripherals active with all clocks on. Power can be conserved by turning off clocks to
2. mA/MHz data valid down to 10 MHz. Below this frequency the ratio mA/MHz increases.
3. ARM core stopped and all peripheral clocks active.
4. ARM core stopped and all peripheral clocks stopped.
5. Results based on characterization, not tested in production.
I
I
I
I
I
I
DDRUN
IDLE
SLEEP(IDD)
SLEEP(IDDQ)
RTC_STBY
SRAM_STBY
DDQ
Symbol
peripherals which are not required.
= 2.7 - 3.6 V, V
Supply current characteristics
Run mode current
Idle mode current
Sleep mode
current, I
Sleep mode
current, I
RTC Standby
current
SRAM Standby
current
Parameter
DD
DD
DDQ
= 1.65 - 2 V, T
Doc ID 13495 Rev 6
All peripherals on
All peripherals off
All peripherals on
All peripherals off
ARM core and all peripheral
clocks stopped (with
exception of RTC), LVD off
ARM core and all peripheral
clocks stopped (with
exception of RTC), LVD on
LVD On
LVD Off
Measured on VBATT pin
Measured on VBATT pin
Test conditions
A
(4)
(4)
= -40 / 85 °C unless otherwise specified.
(1)(2)
(1)(2)
(2)(4)
(2)(3)
Min
Value
1.14
0.45
Typ
1.7
1.3
0.9
50
55
7
7
5
820
825
80
70
Max
0.75
240
2.3
1.6
1.7
1.2
STR91xFAxxx
(5)
(5)
(5)
(5)
mA/MHz
mA/MHz
mA/MHz
Unit
µA
µA
µA
µA
µA