STR910FAZ32H6 STMicroelectronics, STR910FAZ32H6 Datasheet - Page 73

• Manufacturer Part Number: STR910FAZ32H6
• Description: MCU 256KB FLASH 64K RAM 144LFBGA
• Manufacturer: STMicroelectronics
• Series: STR9r

Specifications of STR910FAZ32H6

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 2 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFBGA
• Processor Series: STR910x
• Core: ARM966E-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, IrDA, SSP, UART
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR9-COMSTICK, STR910-EVAL, STR91X-SK/HIT, STR91X-SK/IAR, STR91X-SK/KEI, STR91X-SK/RAI, STR9-DK/RAIS, STR91X-DK/IAR, STX-PRO/RAIS, STR912-D/RAIS, STR79-RVDK/CPP, STR79-RVDKCPP/9, STR79-RVDK, STR79-RVDK/9, STR9-RVDK/BAS, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: 497-8268 - BOARD EVAL FOR EVAL-STR910MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES497-5067 - BOARD EVAL FOR STR910 FAMILY497-5066 - KIT STARTER KEIL FOR STR910497-5065 - KIT STARTER IAR KICKSTART STR912497-5064 - KIT STARTER FOR STR910 FAMILY497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-6277

STR91xFAxxx
7.9.2
Table 28.
1. Data based on characterization results, not tested in production.
2. BGA and LQFP devices have similar EMI characteristics.
7.9.3
7.9.4
Table 29.
1. Data based on characterization results, not tested in production.
V
V
Symbol
ESD(HBM)
ESD(CDM)
S
Symbol
EMI
Peak level
Parameter
ESD data
EMI data
Electro magnetic interference (EMI)
Based on a simple application running on the product (toggling 2 LEDs through the I/O
ports), the product is monitored in terms of emission. This emission test is in line with the
norm SAE J 1752/3 which specifies the board and the loading of each pin.
Absolute maximum ratings (electrical sensitivity)
Based on two different tests (ESD and LU) using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity.
Electro-static discharge (ESD)
Electro-Static Discharges (3 positive then 3 negative pulses separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts*(n+1) supply pin). This test
conforms to the JESD22-A114A/A115A standard. For more details, refer to the application
note AN1181.
Electro-static discharge voltage
(Human Body Model)
Electro-static discharge voltage
(Charged Device Model)
V
T
LQFP128 package
conforming to SAE J
1752/3
A
DDQ
=+25 °C,
= 3.3 V, V
Conditions
Ratings
DD
=1.8 V,
(2)
Doc ID 13495 Rev 6
0.1 MHz to 30 MHz
30 MHz to
130 MHz
130 MHz to 1GHz
SAE EMI Level
Frequency Band
Monitored
T
conforming to
JESD22-A114
T
conforming to
JESD22-C101
A
A
= +25°C
= +25°C
Conditions
48 MHz
24 MHz /
14
18
18
4
Class
[f
OSC
(1)
2
II
Max vs.
Electrical characteristics
/f
CPUCLK
96 MHz
Maximum
24 MHz /
value
+/-2000
1000
]
10
19
22
4
(1)
(1)
dBµV
73/102
Unit
Unit
V
-